Readout interface for capacitive MEMS microphone in CMOS technology

Author(s):  
Daniel Arbet ◽  
Gabriel Nagy ◽  
Martin Kovac ◽  
Viera Stopjakova ◽  
Lukas Nagy
2015 ◽  
Vol 40 (4) ◽  
pp. 527-537 ◽  
Author(s):  
Farès Tounsi ◽  
Brahim Mezghani ◽  
Libor Rufer ◽  
Mohamed Masmoudi

Abstract This paper gives a detailed electroacoustic study of a new generation of monolithic CMOS micromachined electrodynamic microphone, made with standard CMOS technology. The monolithic integration of the mechanical sensor with the electronics using a standard CMOS process is respected in the design, which presents the advantage of being inexpensive while having satisfactory performance. The MEMS microphone structure consists mainly of two planar inductors which occupy separate regions on substrate. One inductor is fixed; the other can exercise out-off plane movement. Firstly, we detail the process flow, which is used to fabricate our monolithic microphone. Subsequently, using the analogy between the three different physical domains, a detailed electro-mechanical-acoustic analogical analysis has been performed in order to model both frequency response and sensitivity of the microphone. Finally, we show that the theoretical microphone sensitivity is maximal for a constant vertical position of the diaphragm relative to the substrate, which means the distance between the outer and the inner inductor. The pressure sensitivity, which is found to be of the order of a few tens of μV/Pa, is flat within a bandwidth from 50 Hz to 5 kHz.


Proceedings ◽  
2020 ◽  
Vol 56 (1) ◽  
pp. 3
Author(s):  
Richard Hopper ◽  
Daniel Popa ◽  
Vasileios Tsoutsouras ◽  
Florin Udrea ◽  
Phillip Stanley-Marbell

In this work, we present a novel thermal acoustic gas sensor, fabricated using a CMOS microhotplate and MEMS microphone. The sensing mechanism is based on the detection of changes in the thermal acoustic conversion efficiency which is dependent on the physical properties of the gas. The gas sensor has all the benefits of CMOS technology, including low cost and miniaturization. Here, we demonstrate its application for CO2 gas detection.


2020 ◽  
Vol 67 (9) ◽  
pp. 1509-1513
Author(s):  
Youngtae Yang ◽  
Byunggyu Lee ◽  
Jun Soo Cho ◽  
Suhwan Kim ◽  
Hyunjoong Lee

2015 ◽  
Vol 15 (12) ◽  
pp. 6853-6860 ◽  
Author(s):  
Byung-Hun Kim ◽  
Hwa-Sun Lee

2005 ◽  
Author(s):  
John F. McClelland ◽  
Michael Pedersen

2019 ◽  
Vol 2019 ◽  
pp. 1-26 ◽  
Author(s):  
Muhammad Ali Shah ◽  
Ibrar Ali Shah ◽  
Duck-Gyu Lee ◽  
Shin Hur

This paper reports a review about microelectromechanical system (MEMS) microphones. The focus of this review is to identify the issues in MEMS microphone designs and thoroughly discuss the state-of-the-art solutions that have been presented by the researchers to improve performance. Considerable research work has been carried out in capacitive MEMS microphones, and this field has attracted the research community because these designs have high sensitivity, flat frequency response, and low noise level. A detailed overview of the omnidirectional microphones used in the applications of an audio frequency range has been presented. Since the microphone membrane is made of a thin film, it has residual stress that degrades the microphone performance. An in-depth detailed review of research articles containing solutions to relieve these stresses has been presented. The comparative analysis of fabrication processes of single- and dual-chip omnidirectional microphones, in which the membranes are made up of single-crystal silicon, polysilicon, and silicon nitride, has been done, and articles containing the improved performance in these two fabrication processes have been explained. This review will serve as a starting guide for new researchers in the field of capacitive MEMS microphones.


2015 ◽  
Vol 120 ◽  
pp. 418-421 ◽  
Author(s):  
P. Honzík ◽  
C. Guianvarc’h ◽  
M. Bruneau

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