Heterogeneous flip-chip assembly of a GaAs C-band power amplifier MMIC using liquid metal vertical interconnects

Author(s):  
P. E. Ralston ◽  
J. Wood ◽  
K. Vummidi ◽  
J. M. Oliver ◽  
S. Raman
Author(s):  
Joseph Wood ◽  
Krishna Vummidi ◽  
Parrish Ralston ◽  
Lihan Chen ◽  
N. Scott Barker ◽  
...  

Author(s):  
E. Rogeaux ◽  
J.-P. Fraysse ◽  
C. Schaffauser ◽  
S. George ◽  
D. Pons ◽  
...  

2000 ◽  
Vol 48 (12) ◽  
pp. 2573-2578 ◽  
Author(s):  
J.J. Xu ◽  
S. Keller ◽  
G. Parish ◽  
S. Heikman ◽  
U.K. Mishra ◽  
...  

Author(s):  
Clarence Rebello ◽  
Ted Kolasa ◽  
Parag Modi

Abstract During the search for the root cause of a board level failure, all aspects of the product must be revisited and investigated. These aspects encompass design, materials, and workmanship. In this discussion, the failure investigation involved an S-Band Power Amplifier assembly exhibiting abnormally low RF output power where initial troubleshooting did not provide a clear cause of failure. A detailed fault tree drove investigations that narrowed the focus to a few possible root causes. However, as the investigation progressed, multiple contributors were eventually discovered, some that were not initially considered.


Author(s):  
Ahmed S. H. Ahmed ◽  
Utku Soylu ◽  
Munkyo Seo ◽  
Miguel Urteaga ◽  
Mark J. W. Rodwell

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