3D hetero-integration technology with backside TSV and reliability challenges

2013 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S) ◽

10.1109/s3s.2013.6716516 ◽

2013 ◽

Author(s):

Kang-Wook Lee ◽

M. Murugesan ◽

T. Fukushima ◽

T. Tanaka ◽

M. Koyanagi

Keyword(s):

Integration Technology

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Extending Database Integration Technology

10.21236/ada384411 ◽

1999 ◽

Author(s):

Peter Buneman ◽

S. Davidson ◽

V. Tannen

Keyword(s):

Database Integration ◽

Integration Technology

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Navigation and Elctro-Optic Sensor Integration Technology for Fusion of Imagery and Digital Mapping Products

10.21236/ada444475 ◽

1999 ◽

Author(s):

Alison Brown ◽

Paul Olson

Keyword(s):

Sensor Integration ◽

Integration Technology ◽

Digital Mapping ◽

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Fully Epitaxial Giant Magnetoresistive Devices with Half-Metallic Heusler Alloy Fabricated on Poly-Crystalline Electrode Using Three-Dimensional Integration Technology

SSRN Electronic Journal ◽

10.2139/ssrn.3559968 ◽

2020 ◽

Author(s):

Jiamin Chen ◽

Yuya Sakuraba ◽

Kay Yakushiji ◽

Yuichi Kurashima ◽

Naoya Watanabe ◽

...

Keyword(s):

Heusler Alloy ◽

Three Dimensional ◽

Half Metallic ◽

Integration Technology

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Study and application of geology-engineering integration technology in tight thin heterogeneous carbonate reservoir

IOP Conference Series Earth and Environmental Science ◽

10.1088/1755-1315/651/3/032081 ◽

2021 ◽

Vol 651 (3) ◽

pp. 032081

Author(s):

Jun Yan ◽

Mingyue Cui ◽

Anle He ◽

Chong Liang ◽

Sukai Wang ◽

...

Keyword(s):

Carbonate Reservoir ◽

Integration Technology ◽

Engineering Integration

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A Review of Flexible Multi-Layer Foil (FMLF) Integration Technology for Passive Components

IEEE Transactions on Power Electronics ◽

10.1109/tpel.2021.3078125 ◽

2021 ◽

pp. 1-1

Author(s):

Cheng Deng ◽

Shuang Li ◽

Jie Tang

Keyword(s):

Passive Components ◽

Integration Technology

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Message from the Vice President, IBM Asset and Integration Technology, Software Group

IBM Systems Journal ◽

10.1147/sj.444.0650 ◽

2005 ◽

Vol 44 (4) ◽

pp. 1-1 ◽

Author(s):

Jason Weisser

Keyword(s):

Vice President ◽

Integration Technology ◽

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Wiring requirement and three-dimensional integration technology for field programmable gate arrays

IEEE Transactions on Very Large Scale Integration (VLSI) Systems ◽

10.1109/tvlsi.2003.810003 ◽

2003 ◽

Vol 11 (1) ◽

pp. 44-54 ◽

Author(s):

A. Rahman ◽

S. Das ◽

A.P. Chandrakasan ◽

R. Reif

Keyword(s):

Three Dimensional ◽

Field Programmable Gate Arrays ◽

Integration Technology ◽

Gate Arrays ◽

Field Programmable ◽

Programmable Gate Arrays

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Process Technology -- Advanced Process and Integration Technology

2006 International Electron Devices Meeting ◽

10.1109/iedm.2006.346951 ◽

2006 ◽

Keyword(s):

Process Technology ◽

Integration Technology

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Design of a Low-cost CO2 Capture Process Based on Heat Integration Technology

Energy Procedia ◽

10.1016/j.egypro.2014.11.1126 ◽

2014 ◽

Vol 61 ◽

pp. 365-368 ◽

Author(s):

Chunfeng Song ◽

Yasuki Kansha ◽

Masanori Ishizuka ◽

Qian Fu ◽

Atsushi Tsutsumi

Keyword(s):

Co2 Capture ◽

Low Cost ◽

Heat Integration ◽

Capture Process ◽

Integration Technology

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Three-dimensional integration technology for sensor application using 5-µm-pitch au cone bump connections

2015 IEEE 65th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2015.7159775 ◽

2015 ◽

Author(s):

Makoto Motoyoshi ◽

Kohki Yanagimura ◽

Junichi Takanohashi ◽

Mariappan Murugesan ◽

Masahiro Aoyagi ◽

...

Keyword(s):

Three Dimensional ◽

Integration Technology ◽

Sensor Application

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