Recent achievements in the thermal characterization of electronic devices by means of boundary condition independent compact models
1997 ◽
pp. 115-124
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1995 ◽
Vol 18
(4)
◽
pp. 723-731
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2007 ◽
Vol 30
(4)
◽
pp. 597-603
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Keyword(s):
2010 ◽
Vol 59
(6)
◽
pp. 1671-1677
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Keyword(s):
1997 ◽
Vol 20
(4)
◽
pp. 399-410
◽
1997 ◽
Vol 20
(4)
◽
pp. 411-419
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