TDCA: Improved Optimization Algorithm with Degree Distribution and Communication Traffic for the Deployment of Software Components Base on AUTOSAR Architecture

AUTOSAR (Automotive Open System Architecture), as an open, standardized framework for automotive electronic software development, has gradually become the standard followed by major automotive manufacturers and automotive electronic device suppliers. The electronic software system problem improves the development efficiency and portability of the system by reducing the development cost of automotive electronic software while ensuring the quality of products and services, which is beneficial for subsequent upgrades and updates of the system. In order to improve the reliability of the software component deployment algorithm based on AUTOSAR architecture, we proposed the TDCA algorithm. During the execution of the algorithm, communication volume and communication degree are introduced to improve the accuracy of the deployment plan by optimizing the bus load and ECU balancing. Algorithm comparison experiments show that comparing heuristic and linear optimization algorithms, the TDCA algorithm proposed in this paper has significant advantages in reducing bus load and balancing ECU utilization. The algorithm can reduce the communication between cores and balance ECU load according to the constraints of AUTOSAR architecture.

Test Plan for the Verification of the Robustness of Sensors and Automotive Electronic Products Using Scenario-Based Noise Deployment (SND)

The targeted shortening of sensor development requires short and convincing verification tests. The goal of the development of novel verification methods is to avoid or reduce an excessive amount of testing and identify tests that guarantee that the assumed failure will not happen in practice. In this paper, a method is presented that results in the test loads of such a verification. The method starts with the identification of the requirements for the product related to robustness using the precise descriptions of those use case scenarios in which the product is assumed to be working. Based on the logic of the Quality Function Deployment (QFD) method, a step-by-step procedure has been developed to translate the robustness requirements through the change in design parameters, their causing phenomena, the physical quantities as causes of these phenomena, until the test loads of the verification. The developed method is applied to the test plan of an automotive sensor. The method is general and can be used for any parts of a vehicle, including mechanical, electrical and mechatronical ones, such as sensors and actuators. Nonetheless, the method is applicable in a much broader application area, even outside of the automotive industry.

Effect of Multiple Reflows on the Interfacial Reactions and Mechanical Properties of an Sn-0.5Cu-Al(Si) Solder and a Cu Substrate

In this study, the interfacial reactions and mechanical properties of solder joints after multiple reflows were observed to evaluate the applicability of the developed materials for high-temperature soldering for automotive electronic components. The microstructural changes and mechanical properties of Sn-Cu solders regarding Al(Si) addition and the number of reflows were investigated to determine their reliability under high heat and strong vibrations. Using differential scanning calorimetry, the melting points were measured to be approximately 227, 230, and 231 °C for the SC07 solder, SC-0.01Al(Si), and SC-0.03Al(Si), respectively. The cross-sectional analysis results showed that the total intermetallic compounds (IMCs) of the SC-0.03Al(Si) solder grew the least after the as-reflow, as well as after 10 reflows. Electron probe microanalysis and transmission electron microscopy revealed that the Al-Cu and Cu-Al-Sn IMCs were present inside the solders, and their amounts increased with increasing Al(Si) content. In addition, the Cu6Sn5 IMCs inside the solder became more finely distributed with increasing Al(Si) content. The Sn-0.5Cu-0.03Al(Si) solder exhibited the highest shear strength at the beginning and after 10 reflows, and ductile fracturing was observed in all three solders. This study will facilitate the future application of lead-free solders, such as an Sn-Cu-Al(Si) solder, in automotive electrical components.

Performance Evaluation of Attribute-Based Encryption in Automotive Embedded Platform for Secure Software Over-The-Air Update

This paper aims to show that it is possible to improve security for over the air update functionalities in an automotive scenario through the use of a cryptographic scheme, called “Attribute-Based-Encryption” (ABE), which grants confidentiality to the software/firmware update done Over The Air (OTA). We demonstrate that ABE is seamlessly integrable into the state of the art solutions regarding the OTA update by showing that the overhead of the ABE integration in terms of computation time and its storage is negligible w.r.t. the other overheads that are introduced by the OTA process, also proving that security can be enhanced with a minimum cost. In order to support our claim, we report the experimental results of an implementation of the proposed ABE OTA technique on a Xilinx ZCU102 evaluation board, which is an automotive-oriented HW/SW platform that is equipped with a Zynq UltraScale+ MPSoC chip that is representative of the computing capability of real automotive Electronic Control Units (ECUs).

Analysis of automotive electronic systems encoders metodological errors

Various types of encoding transducers (encoders) are used in modern technics widely to measuring the characteristics of mechanical motion which is predetermined by their reliability, operation stability and some other positive qualities. At the same time the basic operation principle of this measuring transducers type determines the presence of irremovable methodological errors in the measurements results obtained with their help. These errors reduce the efficiency of target systems. Their accounting and further compensation are possible in the presence of the mathematical apparatus for simulation of the measurement results. In this article substantiation and synthesis of this apparatus which includes the main encoder’s parameters are carried out. The generated mathematical model can be used for the selection or design of encoding transducers to electronic monitoring and control systems for automobiles, tractors as well as other self-moving machines and technical objects at all. Keywords sensor, primary transducer, measuring transducer, error, methodological error, accuracy, measurement, impulses, encoder, encoding transducer, discretization, motion characteristics, movement, speed, acceleration

On the Modeling of Automotive Security: A Survey of Methods and Perspectives

As the intelligent car-networking represents the new direction of the future vehicular development, automotive security plays an increasingly important role in the whole car industry chain. On condition that the accompanying problems of security are proofed, vehicles will provide more convenience while ensuring safety. Security models can be utilized as tools to rationalize the security of the automotive system and represent it in a structured manner. It is essential to improve the knowledge about security models by comparing them besides proposing new methods. This paper aims to give a comprehensive introduction to the topic of security models for the Intelligent Transport System (ITS). A survey of the current methodologies for security modeling is conducted and a classification scheme is subsequently proposed. Furthermore, the existing framework and methods to build automotive security models are broadly examined according to the features of automotive electronic system. A number of fundamental aspects are defined to compare the presented methods in order to comprehend the automotive security modeling in depth.