Thirteenth Annual IEEE. Semiconductor Thermal Measurement and Management Symposium
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Experimental Methods in Air Cooling of Electronics

Thirteenth Annual IEEE. Semiconductor Thermal Measurement and Management Symposium ◽

10.1109/stherm.1997.566776 ◽

2005 ◽

Author(s):

R.J. Moffat ◽

A. Ortega

Keyword(s):

Experimental Methods ◽

Air Cooling ◽

Cooling Of Electronics

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1997 Cumulative Bibliography of Articles on Semiconductor Thermal Measurement, Management and Modeling

Thirteenth Annual IEEE. Semiconductor Thermal Measurement and Management Symposium ◽

10.1109/stherm.1997.566804 ◽

2005 ◽

Author(s):

B.S. Siegal

Keyword(s):

Thermal Measurement

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Pressure drop and heat transfer in an isothermal channel with impinging flow

Thirteenth Annual IEEE. Semiconductor Thermal Measurement and Management Symposium ◽

10.1109/stherm.1997.566800 ◽

2002 ◽

Author(s):

C.R. Biber

Keyword(s):

Heat Transfer ◽

Pressure Drop ◽

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Recent achievements in the thermal characterization of electronic devices by means of boundary condition independent compact models

Thirteenth Annual IEEE. Semiconductor Thermal Measurement and Management Symposium ◽

10.1109/stherm.1997.566780 ◽

2002 ◽

Author(s):

H. Vinke ◽

C.J.M. Lasance

Keyword(s):

Boundary Condition ◽

Electronic Devices ◽

Thermal Characterization ◽

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Multiobjective optimization of component placement on planar printed wiring boards

Thirteenth Annual IEEE. Semiconductor Thermal Measurement and Management Symposium ◽

10.1109/stherm.1997.566786 ◽

2002 ◽

Author(s):

N.V. Queipo ◽

G.F. Gil

Keyword(s):

Multiobjective Optimization ◽

Printed Wiring Boards ◽

Component Placement

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Compact air-cooled heat sinks for power packages

Thirteenth Annual IEEE. Semiconductor Thermal Measurement and Management Symposium ◽

10.1109/stherm.1997.566794 ◽

2002 ◽

Author(s):

A. Aranyosi ◽

L. Bolle ◽

H. Buyse

Keyword(s):

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Comparison of diodes and resistors for measuring chip temperature during thermal characterization of electronic packages using thermal test chips

Thirteenth Annual IEEE. Semiconductor Thermal Measurement and Management Symposium ◽

10.1109/stherm.1997.566797 ◽

2002 ◽

Author(s):

A. Claassen ◽

H. Shaukatullah

Keyword(s):

Thermal Characterization ◽

Electronic Packages ◽

Chip Temperature ◽

Thermal Test ◽

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Hinged heat pipes for cooling notebook PCs

Thirteenth Annual IEEE. Semiconductor Thermal Measurement and Management Symposium ◽

10.1109/stherm.1997.566784 ◽

2002 ◽

Author(s):

M. Mochizuki ◽

Y. Saito ◽

K. Goto ◽

T. Nguyen ◽

Phong Ho ◽

...

Keyword(s):

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High power multichip modules employing the planar embedding technique and microchannel water heat sinks

Thirteenth Annual IEEE. Semiconductor Thermal Measurement and Management Symposium ◽

10.1109/stherm.1997.566782 ◽

2002 ◽

Author(s):

R. Hahn ◽

A. Kamp ◽

A. Ginolas ◽

M. Schmidt ◽

J. Wolf ◽

...

Keyword(s):

Multichip Modules ◽

Planar Embedding ◽

Embedding Technique

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Transient thermal study of laser diodes

Thirteenth Annual IEEE. Semiconductor Thermal Measurement and Management Symposium ◽

10.1109/stherm.1997.566799 ◽

2002 ◽

Author(s):

C.C. Lee ◽

J.W. Lee ◽

D.H. Chien ◽

R. Shih

Keyword(s):

Laser Diodes ◽

Thermal Study ◽

Transient Thermal

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