On multiple fault coverage and aliasing probability measures

Author(s):  
H. Cox ◽  
A. Ivanov ◽  
V.K. Agarwal ◽  
J. Rajski
1997 ◽  
Vol 83 (6) ◽  
pp. 837-848 ◽  
Author(s):  
JOSEPH C. W. PANG ◽  
MIKE W. T. WONG ◽  
Y. S. LEE

Author(s):  
Ling Zhang ◽  
Junjin Mei ◽  
Guan-zhong Wang ◽  
Tonghan Li
Keyword(s):  

2020 ◽  
Vol 4 (1) ◽  
pp. 29-39
Author(s):  
Dilrabo Eshkobilova ◽  

Uniform properties of the functor Iof idempotent probability measures with compact support are studied. It is proved that this functor can be lifted to the category Unif of uniform spaces and uniformly continuous maps


Author(s):  
J. Gaudestad ◽  
F. Rusli ◽  
A. Orozco ◽  
M.C. Pun

Abstract A Flip Chip sample failed short between power and ground. The reference unit had 418Ω and the failed unit with the short had 16.4Ω. Multiple fault isolation techniques were used in an attempt to find the failure with thermal imaging and Magnetic Current Imaging being the only techniques capable of localizing the defect. To physically verify the defect location, the die was detached from the substrate and a die cracked was seen using a visible optical microscope.


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