The Femtosecond Energy Diffusion Sensor: A Non-contact Tool for Photovoltaic Characterization

2005 ◽  
Vol 127 (1) ◽  
pp. 131-137
Author(s):  
James T. McLeskey, ◽  
Pamela M. Norris

The femtosecond energy diffusion sensor is presented as a non-contact tool for the use in the characterization of thin film hydrogenated amorphous silicon (a-Si:H) photovoltaic cells. The sensor is based on the pump-probe technique and when used with the appropriate models, this non-contact, non-destructive tool is shown to be capable of measuring important material characteristics of each layer of a p-i-n junction including bandgap and density of states. When fully developed, it is believed that the sensor could be used in a factory environment to detect and solve problems rapidly and to maintain control of the entire manufacturing process.

2013 ◽  
Vol 33 (10) ◽  
pp. 1031001
Author(s):  
何剑 He Jian ◽  
李伟 Li Wei ◽  
徐睿 Xu Rui ◽  
郭安然 Guo Anran ◽  
祁康成 Qi Kangcheng ◽  
...  

2013 ◽  
Vol 1536 ◽  
pp. 175-180 ◽  
Author(s):  
W. Beyer ◽  
W. Hilgers ◽  
D. Lennartz ◽  
F.C. Maier ◽  
N.H. Nickel ◽  
...  

ABSTRACTAn important property of thin film silicon and related materials is the microstructure which may involve the presence of interconnected and isolated voids. We report on effusion measurements of implanted helium (He) to detect such voids. Several series of hydrogenated and unhydrogenated amorphous silicon films prepared by the methods of plasma deposition, hot wire deposition and vacuum evaporation were investigated. The results show common features like a He effusion peak at low temperatures attributed to He out-diffusion through a compact material or through interconnected voids, and a He effusion peak at high temperatures attributed to He trapped in isolated voids. While undoped plasma-grown device-grade hydrogenated amorphous silicon (a-Si:H) films show a rather low concentration of such isolated voids, its concentration can be rather high in doped a-Si:H, in unhydrogenated evaporated material and others.


1983 ◽  
pp. 186-191
Author(s):  
C. Coluzza ◽  
F. Evangelisti ◽  
P. Fiorini ◽  
G. Fortunato ◽  
A. Frova ◽  
...  

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