Constrained Three-Dimensional Component Layout Using Simulated Annealing

1997 ◽  
Vol 119 (1) ◽  
pp. 28-35 ◽  
Author(s):  
S. Szykman ◽  
J. Cagan
Keyword(s):  
Simulated Annealing ◽  
Packing Density ◽  
Computational Algorithm ◽  
Three Dimensional ◽  
Spatial Constraints ◽  
Layout Algorithm ◽  
Component Layout ◽  
Density Fitting ◽  
Power Drill ◽  
General Component

This research introduces a computational algorithm that uses simulated annealing to optimize three-dimensional component layouts. General component layout problems are characterized by three objectives: achieving high packing density, fitting components into a given container and satisfying spatial constraints on components. This paper focuses on the extension of a simulated annealing packing algorithm to a general layout algorithm through the implementation of a language of spatial constraints that are characteristic of layout problems. These constraints allow the designer to specify desired component proximities or to restrict translation or rotation of components based on a global origin or set of coordinate axes, or relative to other component locations or orientations. The layout of components from a cordless power drill illustrates the algorithm.

A Simulated Annealing-Based Approach to Three Dimensional Component Packing

1994 ◽  
Author(s):  
Simon Szykman ◽  
Jonathan Cagan
Keyword(s):  
Simulated Annealing ◽  
Three Dimensional ◽  
Packing Problem ◽  
Computational Approach ◽  
Vlsi Circuits ◽  
Two Dimensional ◽  
Optimal Solutions ◽  
Layout Problem ◽  
Component Layout ◽  
General Component

Abstract This paper introduces a computational approach to three dimensional component layout that employs simulated annealing to generate optimal solutions. Simulated annealing has been used extensively for two dimensional layout of VLSI circuits; this research extends techniques developed for two dimensional layout optimization to three dimensional problems which are more representative of mechanical engineering applications. In many of these applications, miniaturization trends increase the need to achieve higher packing density and fit components into smaller containers. This research addresses the three dimensional packing problem, which is a subset of the general component layout problem, as a framework in which to solve general layout problems.

A Simulated Annealing-Based Approach to Three-Dimensional Component Packing

1995 ◽  
Vol 117 (2A) ◽  
pp. 308-314 ◽  
Author(s):  
S. Szykman ◽  
J. Cagan
Keyword(s):  
Simulated Annealing ◽  
Mechanical Engineering ◽  
Three Dimensional ◽  
Layout Optimization ◽  
Vlsi Circuits ◽  
Two Dimensional ◽  
Optimal Solutions ◽  
Engineering Applications ◽  
Component Layout ◽  
General Component

This paper introduces a simulated annealing-based approach to three-dimensional component packing that employs simulated annealing to generate optimal solutions. Simulated annealing has been used extensively for two-dimensional layout of VLSI circuits; this research extends techniques developed for two-dimensional layout optimization to three-dimensional problems which are more representative of mechanical engineering applications. This research also provides a framework in which to solve general component layout problems.

Optimal Three-Dimensional Placement of Heat Generating Electronic Components

1997 ◽  
Vol 119 (2) ◽  
pp. 106-113 ◽  
Author(s):  
M. I. Campbell ◽  
C. H. Amon ◽  
J. Cagan
Keyword(s):  
Simulated Annealing ◽  
Simulated Annealing Algorithm ◽  
Three Dimensional ◽  
Heat Transfer Analysis ◽  
Placement Test ◽  
Test Cases ◽  
Electronic Components ◽  
Component Layout ◽  
Temperature Ranges ◽  
Annealing Algorithm

This work introduces an algorithm that uses simulated annealing to perform electronic component layout while incorporating constraints related to thermal performance. A hierarchical heat transfer analysis is developed which is used in conjunction with the simulated annealing algorithm to produce final layout configurations that are densely packed and operate within specified temperature ranges. Examples of three-dimensional component placement test cases are presented including an application to embedded wearable computers.

Anion packing density: a universal quantity for both dense and porous crystalline inorganic phases

2002 ◽  
Vol 58 (3) ◽  
pp. 457-462 ◽  
Author(s):  
F. Liebau ◽  
H. Küppers
Keyword(s):  
High Pressure ◽  
Packing Density ◽  
Three Dimensional ◽  
Ionic Radii ◽  
Generalized Framework ◽  
Molal Volumes ◽  
Definition Of ◽  
Anion Packing ◽  
Very High ◽  
Framework Density

To compare densities of inorganic high-pressure phases their molal volumes or specific gravities are usually employed, whereas for zeolites and other microporous materials the so-called framework density, FD, is applied. The definition of FD, which refers only to phases with three-dimensional tetrahedron frameworks, is extended to a `generalized framework density' d f, which is independent of the dimensionality of the framework and the coordination number(s) of the framework cations. In this paper the anion packing density, d ap, is introduced as a new quantity which is not only applicable to any inorganic phase but, in contrast to FD and d f, also allows quantitative comparisons to be made for crystalline inorganic phases of any kind. The anion packing density can readily be calculated if the volume and content of the unit cell and the radii of the anions of a phase are known. From d ap values calculated for high-pressure silica polymorphs studied under very high pressure, it is concluded that Shannon–Prewitt effective ionic radii do not sufficiently take into account the compressibility of the anions.

Packing of Generic, Three-Dimensional Components Based on Multi-Resolution Modeling

1996 ◽  
Author(s):  
Ashish Kolli ◽  
Jonathan Cagan ◽  
Rob Rutenbar
Keyword(s):  
Simulated Annealing ◽  
Three Dimensional ◽  
Arbitrary Geometry ◽  
Reasonable Time ◽  
Three Dimensional Objects

Abstract A method of optimizing layouts of three-dimensional objects of arbitrary geometry with simulated annealing is presented in this paper. Using multi-resolution models, this approach is able to generate optimal layouts of three-dimensional objects in reasonable time. An example of packing highly non-convex objects illustrates the power of this method.

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