A Simulated Annealing-Based Approach to Three Dimensional Component Packing

1994 ◽  
Author(s):  
Simon Szykman ◽  
Jonathan Cagan
Keyword(s):  
Simulated Annealing ◽  
Three Dimensional ◽  
Packing Problem ◽  
Computational Approach ◽  
Vlsi Circuits ◽  
Two Dimensional ◽  
Optimal Solutions ◽  
Layout Problem ◽  
Component Layout ◽  
General Component

Abstract This paper introduces a computational approach to three dimensional component layout that employs simulated annealing to generate optimal solutions. Simulated annealing has been used extensively for two dimensional layout of VLSI circuits; this research extends techniques developed for two dimensional layout optimization to three dimensional problems which are more representative of mechanical engineering applications. In many of these applications, miniaturization trends increase the need to achieve higher packing density and fit components into smaller containers. This research addresses the three dimensional packing problem, which is a subset of the general component layout problem, as a framework in which to solve general layout problems.

A Simulated Annealing-Based Approach to Three-Dimensional Component Packing

1995 ◽  
Vol 117 (2A) ◽  
pp. 308-314 ◽  
Author(s):  
S. Szykman ◽  
J. Cagan
Keyword(s):  
Simulated Annealing ◽  
Mechanical Engineering ◽  
Three Dimensional ◽  
Layout Optimization ◽  
Vlsi Circuits ◽  
Two Dimensional ◽  
Optimal Solutions ◽  
Engineering Applications ◽  
Component Layout ◽  
General Component

This paper introduces a simulated annealing-based approach to three-dimensional component packing that employs simulated annealing to generate optimal solutions. Simulated annealing has been used extensively for two-dimensional layout of VLSI circuits; this research extends techniques developed for two-dimensional layout optimization to three-dimensional problems which are more representative of mechanical engineering applications. This research also provides a framework in which to solve general component layout problems.

Constrained Three-Dimensional Component Layout Using Simulated Annealing

1997 ◽  
Vol 119 (1) ◽  
pp. 28-35 ◽  
Author(s):  
S. Szykman ◽  
J. Cagan
Keyword(s):  
Simulated Annealing ◽  
Packing Density ◽  
Computational Algorithm ◽  
Three Dimensional ◽  
Spatial Constraints ◽  
Layout Algorithm ◽  
Component Layout ◽  
Density Fitting ◽  
Power Drill ◽  
General Component

This research introduces a computational algorithm that uses simulated annealing to optimize three-dimensional component layouts. General component layout problems are characterized by three objectives: achieving high packing density, fitting components into a given container and satisfying spatial constraints on components. This paper focuses on the extension of a simulated annealing packing algorithm to a general layout algorithm through the implementation of a language of spatial constraints that are characteristic of layout problems. These constraints allow the designer to specify desired component proximities or to restrict translation or rotation of components based on a global origin or set of coordinate axes, or relative to other component locations or orientations. The layout of components from a cordless power drill illustrates the algorithm.

A three-dimensional algorithm using two-dimensional slice data for building multiple parts in layered manufacturing

2000 ◽  
Vol 214 (5) ◽  
pp. 365-378 ◽  
Author(s):  
J Hur ◽  
K Lee ◽  
J Ahn ◽  
H C Lee
Keyword(s):  
Rapid Prototyping ◽  
Three Dimensional ◽  
Packing Problem ◽  
Optimal Placement ◽  
Normal Vector ◽  
Two Dimensional ◽  
Stl File ◽  
Work Volume ◽  
Time Required ◽  
Efficient Packing

In a rapid prototyping process, the time required to build multiple prototype parts can be reduced by building several parts simultaneously in a work volume. Interactive arrangement of the multiple parts, called three-dimensional nesting, is a tedious process and does not guarantee the optimal placement of all the parts. The three-dimensional nesting is well known as a problem requiring intense computation. Thus, an efficient algorithm to solve this problem is still under investigation. This paper presumes that the three-dimensional packing problem can be simplified into a set of two-dimensional irregular polygon nesting problems for each layer to take advantage of the characteristic of a rapid prototyping process, i. e. the process eventually uses two-dimensional slicing data of the STL file. The proposed algorithm uses a no-fit polygon (NFP) to calculate the allowable locations of each slice of a part such that it does not overlap other existing slices in the same z level. Then the allowable position of the part with respect to other parts already located in a work volume can be determined by obtaining the union of all NFPs that are obtained from each slice of the part. Additionally, a genetic algorithm is used to try and determine the various orders of the placement of the part and the various orientations of each part for efficient packing. Various orientations of a part are examined by rotating it about the normal vector of the slice in finite angles and by inversion. The proposed algorithm can be applied to a rapid prototyping process that does not use support structures.

Automated Generation of Optimally Directed Three Dimensional Component Layouts

1993 ◽  
Author(s):  
Simon Szykman ◽  
Jonathan Cagan
Keyword(s):  
Objective Function ◽  
Three Dimensional ◽  
Function Spaces ◽  
Global Optimality ◽  
Layout Problem ◽  
Automated Generation ◽  
Generation Technique ◽  
Novel Approach ◽  
Component Layout ◽  
Design Generation

Abstract This research introduces a novel approach towards automating the generation of three dimensional component layouts. Three dimensional component layout tasks are typically highly combinatorial, and exhibit objective function spaces that can be nonlinear and/or discontinuous due to discrete allowable locations for component placement. We present an approach to the three dimensional component layout problem that employs shape annealing, a design generation technique combining concepts from shape grammars and simulated annealing, to produce optimally directed designs. The shape annealing paradigm sacrifices global optimality in exchange for the ability to find good designs in a reasonable amount of time, given very large, ill-behaved objective function spaces.

THE TWO-DIMENSIONAL PACKING PROBLEM FOR IRREGULAR OBJECTS

2004 ◽  
Vol 13 (03) ◽  
pp. 429-448 ◽  
Author(s):  
PING CHEN ◽  
ZHAOHUI FU ◽  
ANDREW LIM ◽  
BRIAN RODRIGUES
Keyword(s):  
Genetic Algorithms ◽  
Basic Problem ◽  
Piecewise Linear ◽  
Three Dimensional ◽  
Packing Problem ◽  
Two Dimensional ◽  
Linear Representations ◽  
Rectangular Packing ◽  
Work Done ◽  
Cutting Problems

Packing and cutting problems arise in a wide variety of industrial situations. The basic problem is that of determining a good arrangement of objects in a region without any overlap. Much research has been done on two and three dimensional rectangular packing while there has been little work done on irregular packing. In this work, we study the two-dimensional irregular packing problem and provide heuristic solutions which use rectilinear and piecewise-linear representations of objects. These heuristics include Genetic Algorithms and Tabu Search. Experimentation gives good results.

Optimal Three-Dimensional Placement of Heat Generating Electronic Components

1997 ◽  
Vol 119 (2) ◽  
pp. 106-113 ◽  
Author(s):  
M. I. Campbell ◽  
C. H. Amon ◽  
J. Cagan
Keyword(s):  
Simulated Annealing ◽  
Simulated Annealing Algorithm ◽  
Three Dimensional ◽  
Heat Transfer Analysis ◽  
Placement Test ◽  
Test Cases ◽  
Electronic Components ◽  
Component Layout ◽  
Temperature Ranges ◽  
Annealing Algorithm

This work introduces an algorithm that uses simulated annealing to perform electronic component layout while incorporating constraints related to thermal performance. A hierarchical heat transfer analysis is developed which is used in conjunction with the simulated annealing algorithm to produce final layout configurations that are densely packed and operate within specified temperature ranges. Examples of three-dimensional component placement test cases are presented including an application to embedded wearable computers.

Three Dimensional Offline Packing Optimization Problem Based on Genetic Simulated Annealing Algorithm

2015 ◽  
Vol 744-746 ◽  
pp. 1919-1923
Author(s):  
Zhan Zhong Wang ◽  
Jing Fu ◽  
Lan Fang Liu ◽  
Rui Rui Liu
Keyword(s):  
Genetic Algorithm ◽  
Simulated Annealing ◽  
Optimization Problem ◽  
Simulated Annealing Algorithm ◽  
Three Dimensional ◽  
Packing Problem ◽  
Genetic Simulated Annealing Algorithm ◽  
Annealing Algorithm ◽  
Final Optimization ◽  
Packing Optimization

In this paper, we try to solve 3D offline packing optimization problem by combining two methods-genetic algorithm’ global performance and simulated annealing algorithm’ local performance. Given Heuristic rules in loading conditions, we use the optimal preservation strategy and the roulette wheel method to choose selection operator, integrating simulated annealing algorithm into genetic algorithm , and achieving code programming and algorithms by Matlab.This paper carries out an actual loading in a vehicle company in Changchun City, then makes a contrast between the final optimization results and each suppliers’ current packing data.The experimental results show that the algorithm has a certain validity and practicability in multiple container packing problem.

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