Axial Compressor Blade Failure, Design Modification, and its Validation

2015 ◽  
Author(s):  
C. J. Hulme ◽  
S. W. Fiebiger ◽  
J. Szwedowicz
Keyword(s):  
Axial Compressor ◽  
Root Cause Analysis ◽  
Compressor Blade ◽  
Design Tool ◽  
Original Design ◽  
Successful Operation ◽  
Damage Mechanisms ◽  
Design Modification ◽  
Cause Analysis ◽  
Root Cause

Utilising a comprehensive design tool suite and in-house knowledge, the root cause analysis of High Cycle Fatigue (HCF) failures on the first stage compressor blade in a gas turbine (GT) engine is presented in this paper. Based on the experience gained from the root cause analysis more reliable lifetime prediction for compressor blade design is possible. Tip timing measurements of blades in service have been evaluated to obtain valuable information about the real vibratory stress levels of the first stage compressor blades, to validate design methods, and to identify the failure mechanism. Metallurgical evaluation and testing of the failed parts were also used as part of the investigation. During the failure investigations the impacts of important damage mechanisms, not identified in the original design process, were determined. These damage mechanisms included, water droplet erosion of blades due to impingement on highly stressed regions of airfoil, mistuning within manufactured blade sets, and a very strong transient aerodynamic loading. Considering the damage mechanisms, improved design methodologies have been used to design robust compressor blade sets. These have been validated in successful engine tests. Subsequent continued successful operation of new blade designs has been recorded in engines during an extended validation period.

Root Cause analysis of SG tube ODSCC indications within the tube sheets of NPP biblis unit A

2011 ◽  
pp. 78-86
Author(s):  
R. Kilian ◽  
J. Beck ◽  
H. Lang ◽  
V. Schneider ◽  
T. Schönherr ◽  
...  
Keyword(s):  
Root Cause Analysis ◽  
Cause Analysis ◽  
Root Cause

Rule Construction and its Execution for Root Cause Analysis

2012 ◽  
Vol 132 (10) ◽  
pp. 1689-1697
Author(s):  
Yutaka Kudo ◽  
Tomohiro Morimura ◽  
Kiminori Sugauchi ◽  
Tetsuya Masuishi ◽  
Norihisa Komoda
Keyword(s):  
Root Cause Analysis ◽  
Cause Analysis ◽  
Root Cause

Root Cause Analysis Techniques Using Picosecond Time Resolved LADA

2014 ◽  
Author(s):  
Dan Bodoh ◽  
Kent Erington ◽  
Kris Dickson ◽  
George Lange ◽  
Carey Wu ◽  
...  
Keyword(s):  
Integrated Circuits ◽  
Picosecond Laser ◽  
Root Cause Analysis ◽  
Fault Isolation ◽  
Time Resolved ◽  
Cause Analysis ◽  
Root Cause ◽  
Design And Manufacturing ◽  
Multiple Interactions ◽  
Established Technique

Abstract Laser-assisted device alteration (LADA) is an established technique used to identify critical speed paths in integrated circuits. LADA can reveal the physical location of a speed path, but not the timing of the speed path. This paper describes the root cause analysis benefits of 1064nm time resolved LADA (TR-LADA) with a picosecond laser. It shows several examples of how picosecond TR-LADA has complemented the existing fault isolation toolset and has allowed for quicker resolution of design and manufacturing issues. The paper explains how TR-LADA increases the LADA localization resolution by eliminating the well interaction, provides the timing of the event detected by LADA, indicates the propagation direction of the critical signals detected by LADA, allows the analyst to infer the logic values of the critical signals, and separates multiple interactions occurring at the same site for better understanding of the critical signals.

Root Cause Analysis for Pin Leakage

2016 ◽  
Author(s):  
Zhigang Song ◽  
Jochonia Nxumalo ◽  
Manuel Villalobos ◽  
Sweta Pendyala
Keyword(s):  
Failure Analysis ◽  
Root Cause Analysis ◽  
Advanced Technology ◽  
Process Step ◽  
Cause Analysis ◽  
Hard Mask ◽  
Technology Node ◽  
Root Cause ◽  
Tools And Techniques

Abstract Pin leakage continues to be on the list of top yield detractors for microelectronics devices. It is simply manifested as elevated current with one pin or several pins during pin continuity test. Although many techniques are capable to globally localize the fault of pin leakage, root cause analysis and identification for it are still very challenging with today’s advanced failure analysis tools and techniques. It is because pin leakage can be caused by any type of defect, at any layer in the device and at any process step. This paper presents a case study to demonstrate how to combine multiple techniques to accurately identify the root cause of a pin leakage issue for a device manufactured using advanced technology node. The root cause was identified as under-etch issue during P+ implantation hard mask opening for ESD protection diode, causing P+ implantation missing, which was responsible for the nearly ohmic type pin leakage.

Root Cause Analysis for the ATIRCM/CMWS Program

2010 ◽  
Author(s):  
Harold S. Balaban ◽  
Paul M. Kodzwa ◽  
Andrew S. Rehwinkel ◽  
Gregory A. Davis ◽  
Patricia F. Bronson
Keyword(s):  
Root Cause Analysis ◽  
Cause Analysis ◽  
Root Cause
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