Development of a Hermetically Sealed Enclosure for MEMS in Chip-on-Flex Modules Using Liquid Crystalline Polymer (LCP)
Keyword(s):
We present the development of a hermetic shield packaging enclosure for RF microelectromechanical system switches (MEMS) using Liquid Crystal Polymer (LCP). A cavity formed in LCP has been laminated, at low temperature, onto a Si MEMS switch to create a hermetically sealed package. The hermetically sealed enclosure is a stack-up layer of the multi-layer organic chip-on-flex system-on-a-package (SOP). The entire SOP hermetically sealed package has a total insertion loss of ∼0.5 dB at X-band. E595 outgas tests demonstrate that the LCP package is reliable and hermetically protects the MEMS switch.
2008 ◽
Vol 46
(22)
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pp. 7310-7320
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1997 ◽
Vol 301
(1)
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pp. 157-162
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2011 ◽
Vol 129
(3)
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pp. 1142-1145
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