Smart Manufacturing Through a Framework for a Knowledge-Based Diagnosis System

Author(s):  
Michael P. Brundage ◽  
Boonserm Kulvatunyou ◽  
Toyosi Ademujimi ◽  
Badarinath Rakshith

Various techniques are used to diagnose problems throughout all levels of the organization within the manufacturing industry. Often times, this root cause analysis is ad-hoc with no standard representation for artifacts or terminology (i.e., no standard representation for terms used in techniques such as fishbone diagrams, 5 why’s, etc.). Once a problem is diagnosed and alleviated, the results are discarded or stored locally as paper/digital text documents. When the same or similar problem reoccurs with different employees or in a different factory, the whole process has to be repeated without taking advantage of knowledge gained from previous problem(s) and corresponding solution(s). When discussing the diagnosis, personnel may miscommunicate over terms used in the root cause analysis leading to wasted time and errors. This paper presents a framework for a knowledge-based manufacturing diagnosis system that aims to alleviate these miscommunications. By learning from diagnosis methods used in manufacturing and in the medical community, this paper proposes a framework which integrates and formalizes root cause analysis by categorizing faults and failures that span multiple organizational levels. The proposed framework aims to enable manufacturing operations by leveraging machine learning and semantic technologies for the manufacturing system diagnosis. A use case for the manufacture of a bottle opener demonstrates the framework.

2011 ◽  
pp. 78-86
Author(s):  
R. Kilian ◽  
J. Beck ◽  
H. Lang ◽  
V. Schneider ◽  
T. Schönherr ◽  
...  

2012 ◽  
Vol 132 (10) ◽  
pp. 1689-1697
Author(s):  
Yutaka Kudo ◽  
Tomohiro Morimura ◽  
Kiminori Sugauchi ◽  
Tetsuya Masuishi ◽  
Norihisa Komoda

Author(s):  
Dan Bodoh ◽  
Kent Erington ◽  
Kris Dickson ◽  
George Lange ◽  
Carey Wu ◽  
...  

Abstract Laser-assisted device alteration (LADA) is an established technique used to identify critical speed paths in integrated circuits. LADA can reveal the physical location of a speed path, but not the timing of the speed path. This paper describes the root cause analysis benefits of 1064nm time resolved LADA (TR-LADA) with a picosecond laser. It shows several examples of how picosecond TR-LADA has complemented the existing fault isolation toolset and has allowed for quicker resolution of design and manufacturing issues. The paper explains how TR-LADA increases the LADA localization resolution by eliminating the well interaction, provides the timing of the event detected by LADA, indicates the propagation direction of the critical signals detected by LADA, allows the analyst to infer the logic values of the critical signals, and separates multiple interactions occurring at the same site for better understanding of the critical signals.


Author(s):  
Zhigang Song ◽  
Jochonia Nxumalo ◽  
Manuel Villalobos ◽  
Sweta Pendyala

Abstract Pin leakage continues to be on the list of top yield detractors for microelectronics devices. It is simply manifested as elevated current with one pin or several pins during pin continuity test. Although many techniques are capable to globally localize the fault of pin leakage, root cause analysis and identification for it are still very challenging with today’s advanced failure analysis tools and techniques. It is because pin leakage can be caused by any type of defect, at any layer in the device and at any process step. This paper presents a case study to demonstrate how to combine multiple techniques to accurately identify the root cause of a pin leakage issue for a device manufactured using advanced technology node. The root cause was identified as under-etch issue during P+ implantation hard mask opening for ESD protection diode, causing P+ implantation missing, which was responsible for the nearly ohmic type pin leakage.


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