Pulsed plasma polymerization of an aromatic perfluorocarbon monomer: Formation of low dielectric constant, high thermal stability films

2000 ◽  
Vol 18 (2) ◽  
pp. 799 ◽  
Author(s):  
Licheng M. Han ◽  
Richard B. Timmons ◽  
Wei W. Lee
Keyword(s):  
Thermal Stability ◽  
Dielectric Constant ◽  
Plasma Polymerization ◽  
High Thermal Stability ◽  
Low Dielectric Constant ◽  
Pulsed Plasma ◽  
Low Dielectric ◽  
Pulsed Plasma Polymerization

Pulsed plasma polymerization of pentafluorostyrene: Synthesis of low dielectric constant films

1998 ◽  
Vol 84 (1) ◽  
pp. 439-444 ◽  
Author(s):  
Licheng M. Han ◽  
Richard B. Timmons ◽  
Wei W. Lee ◽  
Yuanye Chen ◽  
Zhibing Hu
Keyword(s):  
Dielectric Constant ◽  
Plasma Polymerization ◽  
Low Dielectric Constant ◽  
Pulsed Plasma ◽  
Low Dielectric ◽  
Pulsed Plasma Polymerization

New fluorinated poly(ether sulfone imide)s with high thermal stability and low dielectric constant

2014 ◽  
Vol 143 (2) ◽  
pp. 773-778 ◽  
Author(s):  
Chenyi Wang ◽  
Wentao Chen ◽  
Yunyun Chen ◽  
Xiaoyan Zhao ◽  
Jian Li ◽  
...  
Keyword(s):  
Thermal Stability ◽  
Dielectric Constant ◽  
High Thermal Stability ◽  
Low Dielectric Constant ◽  
Low Dielectric

A flexible insulator of a hollow SiO2 sphere and polyimide hybrid for flexible OLEDs

2015 ◽  
Vol 17 (4) ◽  
pp. 2416-2420 ◽  
Author(s):  
Min Kyu Kim ◽  
Dong Won Kim ◽  
Dong Wook Shin ◽  
Sang Joon Seo ◽  
Ho Kyoon Chung ◽  
...  
Keyword(s):  
Thermal Stability ◽  
Dielectric Constant ◽  
High Thermal Stability ◽  
Low Dielectric Constant ◽  
Low Dielectric

A hollow SiO2 sphere and polyimide hybrid with a low dielectric constant and high thermal stability is useful for flexible insulators.

Hybrid ternary composites of hyperbranched and linear polyimides with SiO2: a research for low dielectric constant and optimized properties

RSC Advances ◽  
2014 ◽  
Vol 4 (80) ◽  
pp. 42737-42746 ◽  
Author(s):  
Seongku Kim ◽  
Xingyuan Wang ◽  
Shinji Ando ◽  
Xiaogong Wang
Keyword(s):  
Thermal Stability ◽  
Dielectric Constant ◽  
High Thermal Stability ◽  
Low Dielectric Constant ◽  
Low Dielectric ◽  
System P ◽  
Composition Optimization

The hybrid ternary composites with low dielectric constant and high thermal stability were fabricated through composition optimization by introducing suitable amounts of inorganic silica and hyperbranched polyimide into a linear polyimide system.

High Tg, Low Dielectric Constant Aromatic Benzoxazoles Containing Allylether Pendent Groups for Use in Microelectronic Packaging

2001 ◽  
Vol 682 ◽  
Author(s):  
Max D. Alexander ◽  
Thuy D. Dang ◽  
Christina E. Specker ◽  
Marlene Houtz ◽  
R.J. Spry ◽  
...  
Keyword(s):  
Thermal Stability ◽  
Dielectric Constant ◽  
High Thermal Stability ◽  
Low Dielectric Constant ◽  
Microelectronic Packaging ◽  
Low Dielectric ◽  
Degradation Temperature ◽  
Low Thermal Expansion ◽  
Lower Dielectric Constant ◽  
Pendent Groups

ABSTRACTNext generation microelectronic packaging requirements are driving the need to produce increasingly lower dielectric constant materials while maintaining high thermal stability and ease of processing. Polymer candidates with exceptionally low dielectric constant (2.0-2.4), high thermal stability (degradation temperature higher than 400°C), high glass transition temperature (greater than 350°C), low water uptake (less than one percent), solubility in selected organic solvents, and low thermal expansion are all required. We have successfully synthesized and characterized several candidate polymers in an effort to address these needs.

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