scholarly journals Recording beam modulation during grating formation

Author(s):  
Michael R. Gleeson ◽  
Feidhlim T. O'Neill ◽  
John T. Sheridan
2005 ◽  
Vol 44 (26) ◽  
pp. 5475 ◽  
Author(s):  
Michael R. Gleeson ◽  
John V. Kelly ◽  
Feidhlim T. O’Neill ◽  
John T. Sheridan

1981 ◽  
Vol 42 (C4) ◽  
pp. C4-597-C4-600 ◽  
Author(s):  
P. D. Persans ◽  
H. Fritzsche
Keyword(s):  

Author(s):  
Qiang Gao ◽  
Mark Zhang ◽  
Ming Li ◽  
Chorng Niou ◽  
W.T. Kary Chien

Abstract This paper examines copper-interconnect integrated circuit transmission electron microscope (TEM) sample contamination. It investigates the deterioration of the sample during ion milling and storage and introduces prevention techniques. The paper discusses copper grain agglomeration issues barrier/seed step coverage checking. The high temperature needed for epoxy solidifying was found to be harmful to sidewall coverage checking of seed. Single beam modulation using a glass dummy can efficiently prevent contamination of the area of interest in a TEM sample during ion milling. Adoption of special low-temperature cure epoxy resin can greatly reduce thermal exposure of the sample and prevent severe agglomeration of copper seed on via sidewall. TEM samples containing copper will deteriorate when stored in ordinary driers and sulphur contamination was found at the deteriorated point on the sample. Isolation of the sample from the ambient atmosphere has been verified to be very effective in protecting the TEM sample from deterioration.


1998 ◽  
Vol 37 (11) ◽  
pp. 2102 ◽  
Author(s):  
John D. Downie ◽  
Doǧan A. Timuçin

Author(s):  
D. Andrienko ◽  
O. Francescangeli ◽  
E. Ouskova ◽  
F. Simoni ◽  
S. Slussarenko ◽  
...  

2015 ◽  
Vol 40 (12) ◽  
pp. 2925 ◽  
Author(s):  
Hu Wang ◽  
Hongji Qi ◽  
Meng Guo ◽  
Yingjie Chai ◽  
Bin Wang ◽  
...  

2004 ◽  
Vol 13 (9) ◽  
pp. 1428-1431 ◽  
Author(s):  
Luo Shou-Jun ◽  
Liu Guo-Dong ◽  
He Qing-Sheng ◽  
Wu Min-Xian ◽  
Jin Guo-Fan ◽  
...  

Sign in / Sign up

Export Citation Format

Share Document