Low-Temperature Epitaxial Growth of Single Crystalline Silicon from Silane

1969 ◽  
Vol 116 (6) ◽  
pp. 872 ◽  
Author(s):  
David Richman ◽  
Robert H. Arlett
2014 ◽  
Vol 71 ◽  
pp. 25-28 ◽  
Author(s):  
Ziheng Liu ◽  
Xiaojing Hao ◽  
Fang Qi ◽  
Anita Ho-Baillie ◽  
Martin A. Green

2013 ◽  
Vol 58 (2) ◽  
pp. 142-150 ◽  
Author(s):  
A.V. Sachenko ◽  
◽  
V.P. Kostylev ◽  
V.G. Litovchenko ◽  
V.G. Popov ◽  
...  

1998 ◽  
Vol 539 ◽  
Author(s):  
T. Cramer ◽  
A. Wanner ◽  
P. Gumbsch

AbstractTensile tests on notched plates of single-crystalline silicon were carried out at high overloads. Cracks were forced to propagate on {110} planes in a <110> direction. The dynamics of the fracture process was measured using the potential drop technique and correlated with the fracture surface morphology. Crack propagation velocity did not exceed a terminal velocity of v = 3800 m/s, which corresponds to 83%7 of the Rayleigh wave velocity vR. Specimens fractured at low stresses exhibited crystallographic cleavage whereas a transition from mirror-like smooth regions to rougher hackle zones was observed in case of the specimens fractured at high stresses. Inspection of the mirror zone at high magnification revealed a deviation of the {110} plane onto {111} crystallographic facets.


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