scholarly journals Mixed Electrical Conditions on Interface Inclusion in a Piezoelectric Bimaterial under Antiplane Mechanical and Inplane Electric Loadings

2018 ◽  
Vol 2018 ◽  
pp. 1-8 ◽  
Author(s):  
A. Sheveleva ◽  
V. Loboda ◽  
A. Kryvoruchko
Keyword(s):  
Exact Analytical Solution ◽  
Electric Displacement ◽  
Engineering Application ◽  
Intensity Factors ◽  
Riemann Boundary Value Problem ◽  
Material Interface ◽  
Riemann Boundary ◽  
Piezoelectric Bimaterial ◽  
Analytical Expressions ◽  
Rigid Interface

An absolutely rigid interface inclusion in a bimaterial piezoelectric space under the action of antiplane mechanical and in-plane electric loadings is analyzed. One zone of the inclusion is electrically insulated while the other part is electrically permeable. This problem is important for engineering application, but it has not been solved earlier in an analytical way. Presenting all electromechanical quantities via sectionally analytic vector functions, the combined Dirichlet-Riemann boundary value problem is formulated. An exact analytical solution of this problem is obtained. Closed form analytical expressions for electromechanical quantities at the interface are derived. Some of these values are also presented graphically along the corresponding parts of the material interface. Singular points of the shear strain and the electric displacement are found and the corresponding intensity factors are determined as well.

scholarly journals Interaction of a Screw Dislocation with Interface and Wedge-Shaped Cracks in One-Dimensional Hexagonal Piezoelectric Quasicrystals Bimaterial

2019 ◽  
Vol 2019 ◽  
pp. 1-7
Author(s):  
Lian he Li ◽  
Yue Zhao
Keyword(s):  
Screw Dislocation ◽  
Electric Fields ◽  
Electric Displacement ◽  
Image Force ◽  
Coupling Constants ◽  
Geometrical Parameters ◽  
Intensity Factors ◽  
One Dimensional ◽  
Special Cases ◽  
Analytical Expressions

Interaction of a screw dislocation with wedge-shaped cracks in one-dimensional hexagonal piezoelectric quasicrystals bimaterial is considered. The general solutions of the elastic and electric fields are derived by complex variable method. Then the analytical expressions for the phonon stresses, phason stresses, and electric displacements are given. The stresses and electric displacement intensity factors of the cracks are also calculated, as well as the force on dislocation. The effects of the coupling constants, the geometrical parameters of cracks, and the dislocation location on stresses intensity factors and image force are shown graphically. The distribution characteristics with regard to the phonon stresses, phason stresses, and electric displacements are discussed in detail. The solutions of several special cases are obtained as the results of the present conclusion.

The use of Riemann problems in solving a class of transcendental equations

1973 ◽  
Vol 73 (1) ◽  
pp. 111-118 ◽  
Author(s):  
E. E. Burniston ◽  
C. E. Siewert
Keyword(s):  
Boundary Value Problem ◽  
Closed Form ◽  
Boundary Value ◽  
Explicit Solutions ◽  
Riemann Boundary Value Problem ◽  
Riemann Problems ◽  
Riemann Boundary ◽  
Canonical Solution ◽  
Transcendental Equations ◽  
Explicit Expressions

AbstractA method of finding explicit expressions for the roots of a certain class of transcendental equations is discussed. In particular it is shown by determining a canonical solution of an associated Riemann boundary-value problem that expressions for the roots may be derived in closed form. The explicit solutions to two transcendental equations, tan β = ωβ and β tan β = ω, are discussed in detail, and additional specific results are given.

The Higher Order Crack Tip Fields for Interfacial Crack between Linear Functionally Graded and Homogeneous Piezoelectric Materials

2014 ◽  
Vol 1015 ◽  
pp. 97-100
Author(s):  
Yao Dai ◽  
Xiao Chong ◽  
Ying Chen
Keyword(s):  
Piezoelectric Materials ◽  
Electric Displacement ◽  
Interfacial Crack ◽  
Crack Tip ◽  
Higher Order ◽  
Functionally Graded ◽  
Linear Functions ◽  
Intensity Factors ◽  
Crack Tip Fields ◽  
Functionally Graded Piezoelectric Materials

The higher order crack-tip fields for an anti-plane crack situated in the interface between functionally graded piezoelectric materials (FGPMs) and homogeneous piezoelectric materials (HPMs) are presented. The mechanical and electrical properties of the FGPMs are assumed to be linear functions of y perpendicular to the crack. The crack surfaces are supposed to be insulated electrically. By using the method of eigen-expansion, the higher order stress and electric displacement crack tip fields for FGPMs and HPMs are obtained. The analytic expressions of the stress intensity factors and the electric displacement intensity factors are derived.

scholarly journals Nonuniformly Loaded Stack of Antiplane Shear Cracks in One-Dimensional Piezoelectric Quasicrystals

2018 ◽  
Vol 2018 ◽  
pp. 1-11
Author(s):  
G. E. Tupholme
Keyword(s):  
Electric Displacement ◽  
Polar Angle ◽  
Antiplane Shear ◽  
Shear Cracks ◽  
Intensity Factors ◽  
One Dimensional ◽  
Isotropic Solid ◽  
Special Cases ◽  
Field Intensity Factors ◽  
Explicit Representations

Representations in a closed form are derived, using an extension to the method of dislocation layers, for the phonon and phason stress and electric displacement components in the deformation of one-dimensional piezoelectric quasicrystals by a nonuniformly loaded stack of parallel antiplane shear cracks. Their dependence upon the polar angle in the region close to the tip of a crack is deduced, and the field intensity factors then follow. These exhibit that the phenomenon of crack shielding is dependent upon the relative spacing of the cracks. The analogous analyses, that have not been given previously, involving non-piezoelectric or non-quasicrystalline or simply elastic materials can be straightforwardly considered as special cases. Even when the loading is uniform and the crack is embedded in a purely elastic isotropic solid, no explicit representations have been available before for the components of the field at points other than directly ahead of a crack. Typical numerical results are graphically displayed.

scholarly journals Interaction between line cracks in an orthotropic layer

2002 ◽  
Vol 29 (1) ◽  
pp. 31-42 ◽  
Author(s):  
Subir Das
Keyword(s):  
Fourier Transform ◽  
Stress Intensity ◽  
Finite Thickness ◽  
Intensity Factors ◽  
Orthotropic Layer ◽  
Finite Hilbert Transform ◽  
Crack Tips ◽  
The Fourier Transform ◽  
Analytical Expressions ◽  
Elastostatic Problem

We deal with the interaction between three coplanar Griffith cracks located symmetrically in the mid plane of an orthotropic layer of finite thickness2h. The Fourier transform technique is used to reduce the elastostatic problem to the solution of a set of integral equations which have been solved by using the finite Hilbert transform technique and Cooke's result. The analytical expressions for the stress intensity factors at the crack tips are obtained for largeh. Numerical values of the interaction effect have been computed for and results show that interaction effects are either shielding or amplification depending on the location of each crack with respect to each other and crack tip spacing as well as the thickness of the layer.

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