Ultrafast Laser Processing: From Micro- to Nanoscale Industrial Applications

2013 ◽  
pp. 587-605
MRS Bulletin ◽  
2016 ◽  
Vol 41 (12) ◽  
pp. 984-992 ◽  
Author(s):  
Eric Mottay ◽  
Xinbing Liu ◽  
Haibin Zhang ◽  
Eric Mazur ◽  
Reza Sanatinia ◽  
...  

Abstract


Nanophotonics ◽  
2017 ◽  
Vol 6 (2) ◽  
pp. 393-413 ◽  
Author(s):  
Koji Sugioka

AbstractThe unique characteristics of ultrafast lasers have rapidly revolutionized materials processing after their first demonstration in 1987. The ultrashort pulse width of the laser suppresses heat diffusion to the surroundings of the processed region, which minimizes the formation of a heat-affected zone and thereby enables ultrahigh precision micro- and nanofabrication of various materials. In addition, the extremely high peak intensity can induce nonlinear multiphoton absorption, which extends the diversity of materials that can be processed to transparent materials such as glass. Nonlinear multiphoton absorption enables three-dimensional (3D) micro- and nanofabrication by irradiation with tightly focused femtosecond laser pulses inside transparent materials. Thus, ultrafast lasers are currently widely used for both fundamental research and practical applications. This review presents progress in ultrafast laser processing, including micromachining, surface micro- and nanostructuring, nanoablation, and 3D and volume processing. Advanced technologies that promise to enhance the performance of ultrafast laser processing, such as hybrid additive and subtractive processing, and shaped beam processing are discussed. Commercial and industrial applications of ultrafast laser processing are also introduced. Finally, future prospects of the technology are given with a summary.


2013 ◽  
Vol 41 (10) ◽  
pp. 790
Author(s):  
Andreas OSTENDORF ◽  
Stella MARAGKAKI

2021 ◽  
Vol 33 (1) ◽  
pp. 012009
Author(s):  
Aiko Narazaki ◽  
Hideyuki Takada ◽  
Dai Yoshitomi ◽  
Kenji Torizuka ◽  
Yohei Kobayashi

Author(s):  
Razvan Stoian ◽  
Alexandre Mermillod-Blondin ◽  
Cyril Mauclair ◽  
Guanghua Cheng ◽  
Konstantin Mishchik ◽  
...  

2017 ◽  
Vol 5 (4) ◽  
Author(s):  
Vahid Nasrollahi ◽  
Pavel Penchev ◽  
Stefan Dimov ◽  
Lars Korner ◽  
Richard Leach ◽  
...  

Laser microprocessing is a very attractive option for a growing number of industrial applications due to its intrinsic characteristics, such as high flexibility and process control and also capabilities for noncontact processing of a wide range of materials. However, there are some constrains that limit the applications of this technology, i.e., taper angles on sidewalls, edge quality, geometrical accuracy, and achievable aspect ratios of produced structures. To address these process limitations, a new method for two-side laser processing is proposed in this research. The method is described with a special focus on key enabling technologies for achieving high accuracy and repeatability in two-side laser drilling. The pilot implementation of the proposed processing configuration and technologies is discussed together with an in situ, on-machine inspection procedure to verify the achievable positional and geometrical accuracy. It is demonstrated that alignment accuracy better than 10 μm is achievable using this pilot two-side laser processing platform. In addition, the morphology of holes with circular and square cross sections produced with one-side laser drilling and the proposed method was compared in regard to achievable aspect ratios and holes' dimensional and geometrical accuracy and thus to make conclusions about its capabilities.


2005 ◽  
Author(s):  
Luke McKinney ◽  
Felix Frank ◽  
David Graper ◽  
Jesse Dean ◽  
Paul Forrester ◽  
...  

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