ABSTRACT3D microstructuring of photosensitive glass is demonstrated by femtosecond (fs) laser for lab-on-a-chip manufacture. True 3D hollow microstructures embedded in the glass are fabricated by the fs laser direct write followed by heat treatment and successive wet etching. A variety of microcomponents for a lab-on-a-chip device like a microfluidics, a microvalve, a microoptics, a microlaser, etc. are fabricated by using this technique. The fs laser direct write process is also applied for selective metallization of internal walls of the hollow microstructures embedded in the glass for electric control of movement of the micromechanical components in the lab-on-a-chip device.
Ultrafast laser processing of copper: A comparative study of experimental and simulated transient optical properties