205 Strain Evaluation of The Micro-structures in Electronic Packages Using The Digital Image Correlation Method

2005 ◽  
Vol 2005.18 (0) ◽  
pp. 27-28
Author(s):  
Nobuyuki SHISHIDO ◽  
Toru IKEDA ◽  
Noriyuki MIYAZAKI
Keyword(s):  
Digital Image Correlation ◽  
Digital Image ◽  
Correlation Method ◽  
Image Correlation ◽  
Electronic Packages ◽  
Digital Image Correlation Method ◽  
Micro Structures

scholarly journals Strain Measurement in Micro-Electronic Packages using the Digital Image Correlation Method

2010 ◽  
Vol 79 (3) ◽  
pp. 237-242
Author(s):  
Toru IKEDA ◽  
Toshifumi KANNO ◽  
Nobuyuki SHISHIDO ◽  
Noriyuki MIYAZAKI ◽  
Hiroyuki TANAKA ◽  
...  
Keyword(s):  
Digital Image Correlation ◽  
Digital Image ◽  
Strain Measurement ◽  
Correlation Method ◽  
Image Correlation ◽  
Electronic Packages ◽  
Digital Image Correlation Method

Strain measurement in micro-electronic packages using the digital image correlation method

2011 ◽  
Vol 25 (11) ◽  
pp. 844-850
Author(s):  
Toru Ikeda ◽  
Toshifumi Kanno ◽  
Nobuyuki Shishido ◽  
Noriyuki Miyazaki ◽  
Hiroyuki Tanaka ◽  
...  
Keyword(s):  
Digital Image Correlation ◽  
Digital Image ◽  
Strain Measurement ◽  
Correlation Method ◽  
Image Correlation ◽  
Electronic Packages ◽  
Digital Image Correlation Method

scholarly journals Thermal Strain Measurement on Electronic Packages Using Digital Image Correlation Method

2008 ◽  
Vol 57 (1) ◽  
pp. 83-89 ◽  
Author(s):  
Nobuyuki SHISHIDO ◽  
Toru IKEDA ◽  
Noriyuki MIYAZAKI ◽  
Kentaro NAKAMURA ◽  
Masashi MIYAZAKI ◽  
...  
Keyword(s):  
Digital Image Correlation ◽  
Digital Image ◽  
Strain Measurement ◽  
Thermal Strain ◽  
Correlation Method ◽  
Image Correlation ◽  
Electronic Packages ◽  
Digital Image Correlation Method
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