scholarly journals Thermal Strain Measurement on Electronic Packages Using Digital Image Correlation Method

2008 ◽  
Vol 57 (1) ◽  
pp. 83-89 ◽  
Author(s):  
Nobuyuki SHISHIDO ◽  
Toru IKEDA ◽  
Noriyuki MIYAZAKI ◽  
Kentaro NAKAMURA ◽  
Masashi MIYAZAKI ◽  
...  
Keyword(s):  
Digital Image Correlation ◽  
Digital Image ◽  
Strain Measurement ◽  
Thermal Strain ◽  
Correlation Method ◽  
Image Correlation ◽  
Electronic Packages ◽  
Digital Image Correlation Method

scholarly journals Strain Measurement in Micro-Electronic Packages using the Digital Image Correlation Method

2010 ◽  
Vol 79 (3) ◽  
pp. 237-242
Author(s):  
Toru IKEDA ◽  
Toshifumi KANNO ◽  
Nobuyuki SHISHIDO ◽  
Noriyuki MIYAZAKI ◽  
Hiroyuki TANAKA ◽  
...  
Keyword(s):  
Digital Image Correlation ◽  
Digital Image ◽  
Strain Measurement ◽  
Correlation Method ◽  
Image Correlation ◽  
Electronic Packages ◽  
Digital Image Correlation Method

Strain measurement in micro-electronic packages using the digital image correlation method

2011 ◽  
Vol 25 (11) ◽  
pp. 844-850
Author(s):  
Toru Ikeda ◽  
Toshifumi Kanno ◽  
Nobuyuki Shishido ◽  
Noriyuki Miyazaki ◽  
Hiroyuki Tanaka ◽  
...  
Keyword(s):  
Digital Image Correlation ◽  
Digital Image ◽  
Strain Measurement ◽  
Correlation Method ◽  
Image Correlation ◽  
Electronic Packages ◽  
Digital Image Correlation Method

G0310504 In-Plane Thermal Strain Measurement on Electronic Packages Using Digital Image Correlation

2014 ◽  
Vol 2014 (0) ◽  
pp. _G0310504--_G0310504-
Author(s):  
Shuichi ARIKAWA ◽  
Yasutaka TOMINAGA ◽  
Satoru YONEYAMA ◽  
Yasuhisa FUJIMOTO ◽  
Yohei OMOTO
Keyword(s):  
Digital Image Correlation ◽  
Digital Image ◽  
Strain Measurement ◽  
Thermal Strain ◽  
Image Correlation ◽  
Electronic Packages
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