1709 Effect of Crack Configuration and Electric Conductivity of Solder Ball on Evaluation of Interface Crack between Solder Ball and Copper by DC-PDM

2010 ◽  
Vol 2010.23 (0) ◽  
pp. 453-454
Author(s):  
Naoya TADA ◽  
Ryoichi NAKAHARA ◽  
Naoto YOSHIDA
2007 ◽  
Vol 2007.7 (0) ◽  
pp. 209-210
Author(s):  
Yusuke EZAKI ◽  
Naoya TADA ◽  
Takahiro ANDOU ◽  
Kazuhiko HORI
Keyword(s):  

2006 ◽  
Vol 20 (25n27) ◽  
pp. 4201-4206
Author(s):  
KYONG-HO CHANG ◽  
CHIN-HYUNG LEE

In this study, path-independent values of the J-integral in the finite element context for an arbitrary three-dimensional interface crack configuration in welds of dissimilar steels are presented. For the fracture mechanics analysis of an interface crack in welds of dissimilar steels, residual stress analysis and fracture analysis must be performed sequentially. In the analysis of cracked bodies containing residual stress, the usual domain integral formation results in path-dependent values of the J-integral. And unlike cracks in homogeneous materials, an interface crack in welds of dissimilar steels always induces both opening and shearing modes of stress in the vicinity of the crack tip. Therefore, this paper discusses modifications of the conventional J-integral that yield path independence in the presence of residual stress and the total J values which can characterize the severity of an interface crack tip in welds of dissimilar steels. A finite element method which can evaluate the J-integral for an interface crack in three-dimensional residual stress bearing bodies is developed using the modified J-integral definition and total J values. The situation when residual stresses only are present is studied as is the case when mechanical stresses are applied in conjunction with a residual stress field.


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