2008 International Conference on Electronic Materials and Packaging
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91
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Published By IEEE

9781424436200
Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

A method of fabricating MEMS accelerometers

2008 ◽  
Author(s):  
S. Chen ◽  
H. T. Chien ◽  
J. Y. Lin ◽  
Y. W. Hsu
Keyword(s):  
Mems Accelerometers

Effect of transition metals on the interfacial reactions in electroless Ni(P)-solder interconnections

2008 ◽  
Author(s):  
Yao-Ren Liu ◽  
Jenn-Ming Song ◽  
Yi-Shao Lai ◽  
Ying-Ta Chiu ◽  
Wei-Ting Chen
Keyword(s):  
Transition Metals ◽  
Interfacial Reactions ◽  
Electroless Ni

Alloying design of Sn-Ag-Cu solders for the improvement in drop test performance

2008 ◽  
Author(s):  
Li-Wei Lin ◽  
Jenn-Ming Song ◽  
Yi-Shao Lai ◽  
Ying-Ta Chiu ◽  
Ning-Cheng Lee
Keyword(s):  
Test Performance ◽  
Drop Test

Variability-aware lTCC spiral inductor synthesis

2008 ◽  
Author(s):  
Tuck-Boon Chan ◽  
Hsin-Chia Lu
Keyword(s):  
Spiral Inductor

Extraction of micro-contact properties using a novel micromachined on-chip apparatus

2008 ◽  
Author(s):  
Ben-Hwa Jang ◽  
Po-Hsun Tseng ◽  
Weileun Fang ◽  
Shin-Way Lin
Keyword(s):  
On Chip

Post-mold cure process simulation of IC packaging

2008 ◽  
Author(s):  
Chi-Hong Shue ◽  
Sheng-Jye Hwang ◽  
Huei-Huang Lee ◽  
Durn-Yuan Huang ◽  
Yao-Jung Lee
Keyword(s):  
Process Simulation ◽  
Cure Process ◽  
Ic Packaging
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