2006 International Conference on Electronic Materials and Packaging
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143
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6
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Published By IEEE

9781424408337
Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Interfacial Reaction of Lead-Free Solders with Lead-Free Finished Leadframes

2006 ◽  
Author(s):  
Y. W. Wong ◽  
C. M. L. Wu ◽  
H. C. B. Woo ◽  
Y. T. Choi ◽  
K. L. Li
Keyword(s):  
Interfacial Reaction ◽  
Lead Free ◽  
Lead Free Solders

Study of a Wafer Level Package (WLP) for Surface Acoustic Wave (SAW) Filter

2006 ◽  
Author(s):  
Shan Gao ◽  
Jupyo Hong ◽  
Taehoon Kim ◽  
Seogmoon Choi ◽  
Sung Yi
Keyword(s):  
Acoustic Wave ◽  
Surface Acoustic Wave ◽  
Wafer Level ◽  
Wafer Level Package

Coupled Thermal-Moisture-Stress Analysis for Electronic Packages

2006 ◽  
Author(s):  
David Cadge ◽  
Jason Wang H.J. ◽  
Junlong Bie ◽  
Xuewei Sun ◽  
Rui Bai ◽  
...  
Keyword(s):  
Stress Analysis ◽  
Moisture Stress ◽  
Electronic Packages

Study of System Dynamics of High-Power LEDs

2006 ◽  
Author(s):  
Bin-Juine Huang ◽  
Chun-Wen Tang ◽  
Jia-Hong Wu
Keyword(s):  
System Dynamics ◽  
High Power

scholarly journals Mechanical Behaviour of Grains in SnAgCu Solder Joints

2006 ◽  
Author(s):  
Jicheng Gong ◽  
Changqing Liu ◽  
Paul P. Conway ◽  
Vadim V. Silberschmidt
Keyword(s):  
Mechanical Behaviour ◽  
Solder Joints ◽  
Snagcu Solder
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