2006 International Conference on Electronic Materials and Packaging
Latest Publications

TOTAL DOCUMENTS

143

(FIVE YEARS 0)

H-INDEX

6

(FIVE YEARS 0)

Published By IEEE

9781424408337

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Mechanical Behaviour of Grains in SnAgCu Solder Joints

2006 International Conference on Electronic Materials and Packaging ◽

10.1109/emap.2006.4430595 ◽

2006 ◽

Author(s):

Jicheng Gong ◽

Changqing Liu ◽

Paul P. Conway ◽

Vadim V. Silberschmidt

Keyword(s):

Mechanical Behaviour ◽

Solder Joints ◽

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Study of Interfacial Reactions by Ni/Sn5Ag/Cu Sandwich Structure

2006 International Conference on Electronic Materials and Packaging ◽

10.1109/emap.2006.4430691 ◽

2006 ◽

Author(s):

H. W. Tseng ◽

C. Y. Liu

Keyword(s):

Sandwich Structure ◽

Interfacial Reactions

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A Comprehensive Study in Thermal Dissipation Assessment of Hard Disk Drive Component

2006 International Conference on Electronic Materials and Packaging ◽

10.1109/emap.2006.4430612 ◽

2006 ◽

Author(s):

Mingzong Wang ◽

Jeng Yung Lai ◽

Yu-Po Wang ◽

C. S. Hsiao

Keyword(s):

Hard Disk Drive ◽

Hard Disk ◽

Thermal Dissipation ◽

Drive Component ◽

Comprehensive Study

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Comparison of Bond Interface Reaction in Al-Ni and Al-Au Systems Formed by Ultrasonic Wedge Bonding

2006 International Conference on Electronic Materials and Packaging ◽

10.1109/emap.2006.4430642 ◽

2006 ◽

Author(s):

Mingyu Li ◽

Hongjun Ji ◽

Chunqing Wang

Keyword(s):

Interface Reaction ◽

Bond Interface ◽

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New 3D Stacked Technology System for PoP/SiP & Electric Components

2006 International Conference on Electronic Materials and Packaging ◽

10.1109/emap.2006.4430680 ◽

2006 ◽

Author(s):

Yukihiro Hirai

Keyword(s):

Technology System

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Interfacial Reaction of Lead-Free Solders with Lead-Free Finished Leadframes

2006 International Conference on Electronic Materials and Packaging ◽

10.1109/emap.2006.4430624 ◽

2006 ◽

Author(s):

Y. W. Wong ◽

C. M. L. Wu ◽

H. C. B. Woo ◽

Y. T. Choi ◽

K. L. Li

Keyword(s):

Interfacial Reaction ◽

Lead Free ◽

Lead Free Solders

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System-In-Package Approach for Ultra-High-Power Semiconductor Devices

2006 International Conference on Electronic Materials and Packaging ◽

10.1109/emap.2006.4430564 ◽

2006 ◽

Author(s):

Jeffrey Chen

Keyword(s):

Semiconductor Devices ◽

Power Semiconductor ◽

Power Semiconductor Devices

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Study of a Wafer Level Package (WLP) for Surface Acoustic Wave (SAW) Filter

2006 International Conference on Electronic Materials and Packaging ◽

10.1109/emap.2006.4430583 ◽

2006 ◽

Author(s):

Shan Gao ◽

Jupyo Hong ◽

Taehoon Kim ◽

Seogmoon Choi ◽

Sung Yi

Keyword(s):

Acoustic Wave ◽

Surface Acoustic Wave ◽

Wafer Level ◽

Wafer Level Package

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Effect of High Temperature Storage on Reliability of Sn-Ag-Cu Flip Chip Solder Bumps

2006 International Conference on Electronic Materials and Packaging ◽

10.1109/emap.2006.4430604 ◽

2006 ◽

Author(s):

Xingjia Huang ◽

S.W. Ricky Lee ◽

Ming Li ◽

William T. Chen

Keyword(s):

High Temperature ◽

Flip Chip ◽

Solder Bumps ◽

High Temperature Storage ◽

Temperature Storage

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Coupled Thermal-Moisture-Stress Analysis for Electronic Packages

2006 International Conference on Electronic Materials and Packaging ◽

10.1109/emap.2006.4430636 ◽

2006 ◽

Author(s):

David Cadge ◽

Jason Wang H.J. ◽

Junlong Bie ◽

Xuewei Sun ◽

Rui Bai ◽

...

Keyword(s):

Stress Analysis ◽

Moisture Stress ◽

Electronic Packages

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