Application of Thermal Flow Simulation to Switching Power Supply Design : Analysis of Temperature of the Components Mounted on the Printed Circuit Board

2002 ◽  
Vol 2002.6 (0) ◽  
pp. 247-248
Author(s):  
Katsuhiro KOIZUMI ◽  
Kuniaki NAGAHARA ◽  
Masaru ISHIZUKA
Keyword(s):  
Power Supply ◽  
Printed Circuit Board ◽  
Flow Simulation ◽  
Design Analysis ◽  
Circuit Board ◽  
Thermal Flow ◽  
Switching Power Supply ◽  
Printed Circuit ◽  
Switching Power

Electromagnetic Compatibility Analysis and Optimization Design of Switching Power Supply Printed Circuit Board

2021 ◽  
Vol 16 (4) ◽  
pp. 552-558
Author(s):  
Wei Zhang ◽  
Wan-Jun Yin ◽  
Xiao-Bo Qiu ◽  
Wei He ◽  
Yi-Xue Yuan ◽  
...  
Keyword(s):  
Power Supply ◽  
Electromagnetic Compatibility ◽  
Printed Circuit Board ◽  
Near Field ◽  
Simulation Method ◽  
Circuit Board ◽  
Switching Power Supply ◽  
Switching Power ◽  
Compatibility Analysis ◽  
Field Radiation

Printed Circuit Board (PCB) is not only an important electrical module of information equipment, but also an important source of electromagnetic radiation. Only when PCB works normally and is compatible with other electrical equipment, the whole information equipment can work normally. Because of the complexity of PCB structure and the difficulty of modeling, the EMC (Electromagnetic Compatibility) analysis of PCB is very difficult. For this reason, Taking the widely used full bridge current double rectifier converter as an example, aiming at the electromagnetic compatibility problems caused by the PCB design of the switching power supply, this paper proposes a simulation method based on the electromagnetic field by establishing the near-field radiation model of the PCB, analyzes the areas with high radiation intensity in the PCB layout, by optimizing the layout and wiring of the PCB, the electromagnetic compatibility performance of the switching power supply is improved. The simulation results show that the near-field radiation characteristics of PCB can be predicted by introducing the electromagnetic field simulation method in the design stage, according to the characteristics of the magnetic field, the optimal design is realized, so that the EMC of the switching power supply reaches the standard, and finally the working performance of the switching power supply is improved.

scholarly journals Finite Element Method Simulation and Characterization of a Thermal Flow Sensor Based on Printed Circuit Board Technology for Various Fluids

Proceedings ◽  
2018 ◽  
Vol 2 (13) ◽  
pp. 833 ◽  
Author(s):  
Thomas Glatzl ◽  
Roman Beigelbeck ◽  
Samir Cerimovic ◽  
Harald Steiner ◽  
Albert Treytl
Keyword(s):  
Finite Element Method ◽  
Finite Element ◽  
Printed Circuit Board ◽  
Flow Sensor ◽  
Circuit Board ◽  
Thermal Flow ◽  
Fem Simulations ◽  
Printed Circuit ◽  
Thermal Flow Sensor ◽  
Element Method

We present finite element method (FEM) simulations of a thermal flow sensor as well as a comparison to measurement results. The thermal sensor is purely based on printed circuit board (PCB) technology, designed for heating, ventilation, and air conditioning (HVAC) systems. Design and readout method of the sensor enables the possibility to measure the flow velocity in various fluids. 2D-FEM simulations were carried out in order to predict the sensor characteristic of envisaged setups. The simulations enable a fast and easy way to evaluate the sensor’s behaviour in different fluids. The results of the FEM simulations are compared to measurements in a real environment, proving the credibility of the model.

Monolithic Integration of a Flexible Micro Thermal Flow Sensor

2015 ◽  
Vol 748 ◽  
pp. 89-92
Author(s):  
Shuai Zhao ◽  
Rong Zhu
Keyword(s):  
Power Consumption ◽  
System Integration ◽  
Printed Circuit Board ◽  
Performance Test ◽  
Flow Sensor ◽  
Circuit Board ◽  
Thermal Flow ◽  
Temperature Drift ◽  
Printed Circuit ◽  
Thermal Flow Sensor

In this paper, a novel monolithically integrated flexible thermal flow sensor combining four resistors in a Wheatstone bridge including hot-film resistor, temperature-compensating resistor and two other balancing resistors on one chip is proposed in order to improve the system integration level and sensor performances, such as signal to noise ratio (SNR), power consumption and temperature compensation. Fabricating the sensor directly on a flexible polyimide printed circuit board (PCB) by incorporating printed circuit technique with micromachining sputter technique is adopted. A complete performance test on the flow sensor demonstrates its superiorities on power consumption, SNR and temperature drift, the error of which is eliminated from 43% to 8% over a range of ambient temperature (35–75°C).

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