In-situ observation of fatigue crack propagation at high temperature for SiC/Ti composite

2003 ◽  
Vol 2003.11 (0) ◽  
pp. 153-154
Author(s):  
Yoshihisa TANAKA ◽  
ZHEN YAN Deng ◽  
Yu Fu LIU
Keyword(s):  
Fatigue Crack ◽  
High Temperature ◽  
Crack Propagation ◽  
Fatigue Crack Propagation ◽  
In Situ Observation

In-situ Observation of Interfacial Fatigue Crack Propagation for GF/Epoxy Model Composite using Couple Fiber Shear Method

2003 ◽  
Vol 2003 (0) ◽  
pp. 103-104
Author(s):  
Yukinobu MATSUSHITA ◽  
Ryohei KONISHI ◽  
Masaki HOJO ◽  
Mototsugu TANAKA ◽  
Shojiro OCHIAI
Keyword(s):  
Fatigue Crack ◽  
Crack Propagation ◽  
Fatigue Crack Propagation ◽  
In Situ Observation ◽  
Model Composite

In situ observation of cyclic fatigue crack propagation of SiC-fiber/SiC composite at room temperature

1996 ◽  
Vol 220 (1-2) ◽  
pp. 100-108 ◽  
Author(s):  
S.J. Zhu ◽  
Y. Kagawa ◽  
M. Mizuno ◽  
S.Q. Guo ◽  
Y. Nagano ◽  
...  
Keyword(s):  
Fatigue Crack ◽  
Crack Propagation ◽  
Fatigue Crack Propagation ◽  
Room Temperature ◽  
Cyclic Fatigue ◽  
In Situ Observation ◽  
Sic Fiber

Fatigue Crack Propagation Tests on 304 Stainless Steel in High Temperature Water: Accelerated Cracking Rates and Transition to Lower Rates

2004 ◽  
Author(s):  
G. L. Wire ◽  
W. M. Evans ◽  
W. J. Mills
Keyword(s):  
Stainless Steel ◽  
Fatigue Crack ◽  
High Temperature ◽  
Crack Propagation ◽  
Fatigue Crack Propagation ◽  
Hold Time ◽  
304 Stainless Steel ◽  
High Temperature Water ◽  
Stress Ratios ◽  
Temperature Water

Previous fatigue crack propagation (FCP) tests on a single heat of 304 stainless steel (304 SS) specimens showed a strong acceleration of rates in high temperature water with 40–60 cc H2/kg H2O at 288°C, with rates up to 20X the air rates. The accelerated rates were observed under fully reversed conditions (R = −1) (Wire and Mills, 2001) and high stress ratios (R = 0.7 and 0.83) (Evans and Wire, 2001). In this study, a second heat of 304 SS has been tested at 243°C and 288°C and lower positive stress ratios (R = 0.3, 0.5). The second heat showed the large acceleration of rates at 288°C observed previously. Rates were up to two times lower at 243°C, but were still 7–8X the air rates. A time-based correlation successfully correlates the accelerated rates observed, and is nearly identical to fits of literature data in hydrogen water chemistry (HWC), which has hydrogen added at a lower level of about 1 cc/kg H2O. The accelerated rates on the second heat were not stable under two different test conditions. In contrast to the first heat, the second heat showed a reduction in environmental enhancement at long rise times, accompanied by a change in fracture mode. Addition of a constant load hold time of 1200 s between cycles also caused a marked reduction in crack propagation rates in both heats, with reduction to nearly air rates in the second heat. The differing rise time effects between the two heats could be rationalized by time-dependent deformation. More hold time testing is required to define the material and loading conditions which lead to reduced rates.

In-Situ Monitoring via Synchrotron Radiation Laminography of Thermal Fatigue Cracks at Die-Attached Joints Under Cyclic Energization Loading

2017 ◽  
Author(s):  
Hiroyuki Tsuritani ◽  
Toshihiko Sayama ◽  
Yoshiyuki Okamoto ◽  
Takeshi Takayanagi ◽  
Masato Hoshino ◽  
...  
Keyword(s):  
Fatigue Crack ◽  
Crack Propagation ◽  
Fatigue Crack Propagation ◽  
Thermal Fatigue ◽  
Fatigue Cracks ◽  
In Situ Monitoring ◽  
X Ray ◽  
Crack Propagation Process ◽  
Thermal Fatigue Cracks

Recently, due to the increasing heat density of printed circuit boards (PCBs), thermal fatigue damage in the joints has exerted a more significant influence on the reliability of electronic components. Accordingly, the development of a new nondestructive inspection technology is strongly desired by related industries. The authors have applied a synchrotron radiation X-ray micro-tomography system to the nondestructive observation of micro-cracks. However, the reconstruction of CT images is difficult for planar objects such as PCB substrates, due to insufficient X-ray transmission in the direction parallel to the substrates. In order to solve this problem, a synchrotron radiation laminography system was developed to relax size restrictions on the observation samples, and was applied to the three-dimensional nondestructive evaluation of several kinds of solder joints, which were loaded under accelerated thermal cyclic conditions via thermal shock tests. Moreover, the thermal fatigue crack propagation process that occurs under actual PCB energization loading conditions will differ from that under the usual acceleration test conditions. In this work, the possibility of in-situ monitoring of the thermal fatigue crack propagation process using the laminography system was investigated at die-attached joints subjected to cyclic energization loading, which is close to the actual usage conditions of PCBs. The optical system developed for use in the laminography system was constructed to provide a rotation stage with a tilt from the horizontally incident X-ray beam, and to obtain X-ray projection images via a beam monitor. In this manner, the X-ray beam is sufficiently transmitted through the planar specimen in all projections. The observed specimens included several die-attached joints, in which 3 mm square ceramic dies had been mounted on a 40 mm square FR-4 substrate using Sn-3.0wt%Ag-0.5wt%Cu solder. Consequently, the laminography system was successfully applied to the in-situ monitoring of thermal fatigue cracks that appeared in the solder layer under cyclic energization. This was possible because the laminography images obtained in the energization state have a quality that is equivalent to those obtained in a non-energized state, provided that the temperature distribution of the specimen is stable. In addition, the fatigue crack propagation process can be quantitatively evaluated by measuring the crack surface area and calculating the average crack propagation rate. However, in some cases, the appearance of thermal fatigue cracks was not observed in a solder layer that had been loaded by the accelerated thermal cycle test. This result strongly suggests that delamination occurred at the interface, which indicates that the corresponding fracture mode was significantly influenced by the type of thermal loading.

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