scholarly journals Numerical investigation of different nozzle-jet distributions based on chessboard high-topology composite heat sink

2021 ◽  
Author(s):  
QianLei SHI ◽  
Qian LIU ◽  
KaiXuan LI ◽  
Xing JU ◽  
Chao XU
Keyword(s):  
Numerical Investigation ◽  
Heat Sink ◽  
Composite Heat

A Novel, Low-Cost C-C Composite Heat Sink Material

1996 ◽  
Vol 445 ◽  
Author(s):  
W. Kowbel ◽  
V. Chellappa ◽  
J.C. Withers
Keyword(s):  
Thermal Conductivity ◽  
Heat Sink ◽  
Low Cost ◽  
Mechanical And Thermal Properties ◽  
New Class ◽  
Dielectric Coatings ◽  
Potential Applications ◽  
New Material ◽  
New Type ◽  
Composite Heat

AbstractRapid advances in high power electronics packaging require the development of new heat sink materials. Advanced composites designed to provide thermal expansion control as well as improved thermal conductivity have the potential to provide benefits in the removal of excess heat from electronic devices. Carbon-carbon (C-C) composits are under consideration for several military and space electronic applications including SEM-E electronic boxes. The high cost of C-C composits has greatly hindered their wide spread commercialization. A new manufacturing process has been developed to produce high thermal conductivity (over 400 W/mK) C-C composites at greatly reduced cost (less than $50/lb). This new material has potential applications as both a heat sink and a substrate. Dielectric coatings such as A1N and diamond were applied to this new type of heat sink material. Processing, as well as mechanical and thermal properties of this new class of heat sink material will be presented.

Numerical Investigation of Flow Boiling in a Manifold Microchannel Heat Sink With Conjugate Heat Transfer

2019 ◽  
Author(s):  
Zhichuan Sun ◽  
Yang Luo ◽  
Junye Li ◽  
Wei Li ◽  
Jingzhi Zhang ◽  
...  
Keyword(s):  
Heat Transfer ◽  
Numerical Investigation ◽  
Heat Sink ◽  
Conjugate Heat Transfer ◽  
Flow Boiling ◽  
High Heat Flux ◽  
Microchannel Heat Sink ◽  
Two Phase ◽  
Boiling Process ◽  
Manifold Microchannel

Abstract The manifold microchannel heat sink receives an increasing number of attention lately due to its high heat flux dissipation. Numerical investigation of boiling phenomena in manifold microchannel (MMC) heat sinks remains a challenge due to the complexity of fluid route and the limitation of numerical accuracy. In this study, a computational fluid dynamics (CFD) approach including subcooled two-phase flow boiling process and conjugate heat transfer effect is performed using a MMC unit cell model. Different from steady-state single phase prediction in MMC heat sink, this type of modeling allows for the transient simulation for two-phase interface evolution during the boiling process. A validation case is conducted to validate the heat transfer phenomenon among three phases. Besides, this model is used for the assessment of the manifold dimensions in terms of inlet and outlet widths at the mass flux of 1300 kg/m2·s. With different ratios of inlet-to-outlet area, the thermal resistances remain nearly stable.

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