This paper describes our recent work on the mechanical reliability of a commercial MEMS microphone by performing three mechanical tests, i.e. a constant acceleration test, a mechanical shock test, and a random vibration test, according to the standard of Mil-Std-883. We find that, the studied MEMS part of the microphone can survive a stress limit above 20000g. Two failure modes, i.e. the breaking of diaphragm and the backplate and the delamination of the electrode from the backplate are revealed in the three tests.
