Crack Initiation Under Generalized Plane-Strain Conditions

Out-of-plane strains and stresses are determined using reciprocity for the central region of very long bars (approaching infinite length) of uniform transverse cross section subjected to the same in-plane loads on every cross section. The loading explicitly specifies no end loads on the bars. The results are obtained without recourse to the in-plane solution. Conversely the end force and moment are determined for the case where the out-of-plane strain is zero.

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Greens's functions for an anisotropic elliptic inclusion under generalized plane strain deformations

The Quarterly Journal of Mechanics and Applied Mathematics ◽

10.1093/qjmam/49.1.1 ◽

1996 ◽

Vol 49 (1) ◽

pp. 1-18 ◽

Cited By ~ 19

Author(s):

T. Ting

Keyword(s):

Plane Strain ◽

Elliptic Inclusion ◽

Generalized Plane Strain

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Thermal Stresses in Layered Electrical Assemblies Bonded With Solder

Journal of Electronic Packaging ◽

10.1115/1.2905419 ◽

1991 ◽

Vol 113 (4) ◽

pp. 350-354 ◽

Cited By ~ 29

Author(s):

H. S. Morgan

Keyword(s):

Residual Stresses ◽

Plane Strain ◽

3D Model ◽

Thermal Stresses ◽

Three Dimensional ◽

Creep Models ◽

Strain Model ◽

Maximum Stresses ◽

Generalized Plane Strain ◽

Plane Strain Model

Thermal stresses in a layered electrical assembly joined with solder are computed with plane strain, generalized plane strain, and three-dimensional (3D) finite element models to assess the accuracy of the two-dimensional (2D) modeling assumptions. Cases in which the solder is treated as an elastic and as a creeping material are considered. Comparison of the various solutions shows that, away from the corners, the generalized plane strain model produces residual stresses that are identical to those computed with the 3D model. Although the generalized plane strain model cannot capture corner stresses, the maximum stresses computed with this 2D model are, for the mesh discretization used, within 12 percent of the corner stresses computed with the 3D model when the solder is modeled elastically and within 5 percent when the solder is modeled as a creeping material. Plane strain is not a valid assumption for predicting thermal stresses, especially when creep of the solder is modeled. The effect of cooling rate on the residual stresses computed with creep models is illustrated.

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