The adhesion energy between polymer thin films and self-assembled monolayers

1998 ◽  
Vol 13 (12) ◽  
pp. 3555-3564 ◽  
Author(s):  
Andrew V. Zhuk ◽  
Anthony G. Evans ◽  
John W. Hutchinson ◽  
George M. Whitesides

A superlayer test has been adapted for the measurement of the fracture energy between epoxy thin films and self-assembled monolayers (SAM's) on Au/Ti/Si substrates. The “arrest” mode of analysis has been shown to provide consistent results, particularly when relatively wide lines are used to encourage lateral decohesions. The fracture energy, Γi, of the interface between the monolayer and the epoxy is varied by adjusting the ratio of COOH/CH3 terminal groups. Connections among Γi, the surface energies, and the inelastic deformations occurring in the epoxy are explored upon comparison with interface crack growth simulations.

2009 ◽  
Vol 25 (1) ◽  
pp. 83-86 ◽  
Author(s):  
Guo-Qiang TAN ◽  
Hai-Yang BO ◽  
Hong-Yan MIAO ◽  
Ao XIA ◽  
Zhong-Liang HE

Langmuir ◽  
2020 ◽  
Vol 36 (31) ◽  
pp. 9259-9268 ◽  
Author(s):  
Takashi Ito ◽  
Herman Coceancigh ◽  
Yi Yi ◽  
Jay N. Sharma ◽  
Fred C. Parks ◽  
...  

2001 ◽  
Vol 695 ◽  
Author(s):  
G. Cui ◽  
M. Lane ◽  
K. Vijayamohanan ◽  
G. Ramanath

ABSTRACTAs the critical feature size in microelectronic devices continues to decrease below 100 nm, new barrier materials of > 5 nm thickness are required. Recently we have shown that self-assembled monolayers (SAMs) are attractive candidates that inhibit Cu diffusion into SiO2. For SAMs to be used as barriers in real applications, however, they must also promote adhesion at the Cu/dielectric interfaces. Here, we report preliminary quantitative measurements of interfacial adhesion energy and chemical binding energy of Cu/SiO2 interfaces treated with nitrogen-terminated SAMs. Amine-containing SAMs show a ~10% higher adhesion energy with Cu, while interfaces with Cu-pyridine bonds actually show degraded adhesion, when compared with that of the reference Cu/SiN interface. However, X-ray photoelectron spectroscopy (XPS) measurements show that Cu-pyridine and Cu-amine interactions have a factor-of-four higher binding energy than that of Cu-N bonds at Cu/SiN interfaces. The lack of correlation between adhesion and chemical binding energies is most likely due to incomplete coverage of SAMs.


2016 ◽  
Vol 20 (08n11) ◽  
pp. 1264-1271 ◽  
Author(s):  
Hanna Hakola ◽  
Essi Sariola-Leikas ◽  
Paavo Jäntti ◽  
Thomas Mokus ◽  
Kati Stranius ◽  
...  

Formation of self-assembled monolayers (SAMs) of three porphyrin and one phthalocyanine derivatives on thin ZnO film was studied by monitoring absorption spectra of the samples. The compounds were equipped with carboxylic or phosphate groups to bind to the surface. The SAM formation was found to be fast. The layer was formed in less than 15 min for all studied porphyrins, and 30 min was sufficient to form phthalocyanine layer. For porphyrins with different anchor groups the SAM formation was too fast to see any difference between the anchoring groups. The stability of SAMs was tested then by immersing the samples into neat solvents. Upon immersion the SAMs were gradually losing the absorbance for all the compounds with degradation trends being in line with p[Formula: see text] values of the binding groups of the same type. However, even for the weakest binding group the SAM was relatively stable after a few tens of minutes of washing, which was sufficient to remove physisorbed compounds but the SAM was essentially not destroyed. Comparison of SAMs on thin films with SAMs on ZnO nanorods and TiO2 nanoparticle films indicated the same fast layer formation but relatively weaker SAMs stability, showing 20–40% faster absorption losses during the washing.


2019 ◽  
Vol 4 (2) ◽  
pp. 431-436
Author(s):  
Na Kong ◽  
Shuang Zhang ◽  
Jing Liu ◽  
Jianmei Wang ◽  
Zhen Liu ◽  
...  

Design and formation of electron transfer pathways across self-assembled monolayers by the hydrophobic attachment of BN-NH2 and MoS2 nanosheets.


1997 ◽  
Vol 26 (11) ◽  
pp. 1147-1148 ◽  
Author(s):  
Junfu Liu ◽  
Lingang Zhang ◽  
Pansong Mao ◽  
Deying Chen ◽  
Ning Gu ◽  
...  

ChemInform ◽  
2010 ◽  
Vol 29 (16) ◽  
pp. no-no
Author(s):  
M. AGARWAL ◽  
M. R. DE GUIRE ◽  
A. H. HEUER

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