High-Performance InGaAs HEMTs on Si Substrates for RF Applications

In this paper, we have fabricated InGaAs high-electron-mobility transistors (HEMTs) on Si substrates. The InAlAs/InGaAs heterostructures were initially grown on InP substrates by molecular beam epitaxy (MBE), and the adhesive wafer bonding technique was employed to bond the InP substrates to Si substrates, thereby forming high-quality InGaAs channel on Si. The 120 nm gate length device shows a maximum drain current (ID,max) of 569 mA/mm, and the maximum extrinsic transconductance (gm,max) of 1112 mS/mm. The current gain cutoff frequency (fT) is as high as 273 GHz and the maximum oscillation frequency (fMAX) reaches 290 GHz. To the best of our knowledge, the gm,max and the fT of our device are the highest ever reported in InGaAs channel HEMTs on Si substrates at given gate length above 100 nm.

Исследование влияния обработки поверхности Si-подложек на морфологию слоев GaP, полученных методом плазмохимического атомно-слоевого осаждения

Investigations of atomic-layer deposition of GaP layers on Si substrates with different orientations and with different preliminary surface treatment have been carried out. The deposition of GaP was carried out by the method of plasma enhanced atomic-layer deposition using in situ treatment in argon plasma. It was shown that at the initial stage of the growth of GaP layers on precisely oriented (100) Si substrates and with misorientation, two-dimensional growth occurs both after chemical and plasma surface treatment. Upon growth on (111) substrates, after plasma treatment of the surface, a transition to three-dimensional growth is observed, at which the size of islands reaches 30–40 nm. The smallest root-mean-square roughness of the surface of the growing GaP layers (<0.1 nm) was achieved for (100) substrates with a misorientation of 4 °. The GaP layers grown on (100) substrates had a roughness of ~ 0.1 nm, and on substrates with the (111) orientation - 0.12 nm. It was found that the surface treatment of Si substrates with the (100) orientation in hydrogen plasma leads to a slight increase in the surface roughness of growing GaP layers (0.12–0.14 nm), which is associated with the effect of inhomogeneous etching of silicon in hydrogen plasma. When treating the (100) silicon surface in argon plasma, the surface roughness does not change significantly in comparison with the chemical surface treatment. On the surface of substrates with preliminary deposition of an epitaxial Si layer with a thickness of 4 nm, the morphology of GaP layers is the same as in the case of using hydrogen plasma.

Особенности зарождения и роста нитевидных нанокристаллов InGaN на подложках SiC/Si методом хлорид-гидридной эпитаксии

The growth of InGaN layers on hybrid SiC/Si substrates with orientations (100), (110), and (111) by the HVPE method was studied at temperatures that wittingly exceed the temperature of InN decomposition onto nitrogen atoms and metallic In (1000C). On substrates with orientations (110) and (111), the formation of InGaN nanocrystals was observed. The shape and growth mechanisms of nanocrystals were investigated. It is shown that nanocrystals nucleate on the (111) surface only inside V-defects formed at the points where screw dislocations exit onto the surface. On the (110) surface, nanocrystals are formed only on pedestals that arise during the film growth. An explanation is given for the difference in the growth mechanisms of nanocrystals on substrates of different orientations.

Residue-Free Suspended Graphene Transferred by Perforated Template

A residue-free transfer method for graphene is proposed in this study, especially for the fabrication of suspended structures. Using perforated polymer templates, graphene can be precisely transferred onto the specific position in the perforated target SiO2/Si substrates without the need for polymer removal and the subsequent thermal annealing process. The surface of the transferred graphene by the proposed method was analyzed and corroborated via Raman spectroscopy, Fourier transform infrared spectroscopy, transmission electron microscopy. The results of these analyses suggest that the graphene surface has no polymeric residues resulting from the transfer process. The proposed method provides a powerful approach for the transfer of 2D materials and it enables the exploitation of their suspended structures for device applications as well as the physical characterizations without worry on the effect of contaminants.

ROUGHNESS AND STRUCTURE OF InGaAsN THIN FILMS ON Si

Методом импульсного лазерного напыления в атмосфере аргоно-азотной газовой смеси из мишени InGaAs впервые были получены тонкие пленки InGaAsN на подложках GaAs и Si. Мишень lnGaAs формировалась методом одноосного прессования из порошков GaAs и lnAs. Методами атомно силовой микроскопии и рентгеновской дифракции исследованы морфология поверхности и структура данных тонких пленок. Показано, что пленки InGaAsN на Si имеют средний размер кристалла 0,93 нм, а пленки и InGaAsN на GaAs - 0,99 нм. Определено, что уменьшение давления аргоно-азотной смеси при импульсном лазерном напылении тонких пленок InGaAsN на подложках GaAs и Si приводит к снижению значения среднеквадратичной шероховатости поверхности. Наименьшую среднеквадратическую шероховатость равную 0,25 нм имела тонкая пленка InGaAsN на подложке GaAs, полученная в вакууме, наибольшую среднеквадратическую шероховатость имела тонкая пленка InGaAsN на подложке Si, полученная при давления аргоно-азотной смеси от 10 Па - 19,37 нм. By the method of pulsed laser deposition in atmosphere of an argon-nitrogen gas mixture, for the first time thin InGaAsN films on GaAs and Si substrates were obtained from the InGaAs target. The InGaAs target was formed by uniaxial pressing from GaAs and InAs powders. The surface morphology and structure of these thin films are studied by atomic force microscopy and X-ray diffraction. It is shown that InGaAsN films on Si have an average crystal size of 0,93 nm, and InGaAsN films on GaAs of 0,99 nm. It is determined that a decrease in the pressure of an argon-nitrogen mixture during pulsed laser deposition of thin InGaAsN films on GaAs and Si substrates leads to a decrease in the value of the root- mean-square roughness of the surface. The smallest root-mean-square roughness equal to 0,25 nm had a thin InGaAsN film on a GaAs substrate obtained in vacuum, the largest root-mean- square roughness of 19,37 nm had a thin InGaAsN film on a Si substrate obtained at the argon-nitrogen mixture pressure of 10 Pa -.

The Characterization of Amorphous AZO-n/Si-p Hetrojunction Diode for Solar Cell Application

The aim of the present study is to verify the effect of annealing temperature variation on zinc oxide doped with aluminum (AZO) thin films deposited on p-type silicon (Si) substrates. Here, AZO/p-Si heterojunction was annealed in nitrogen environment and its structural, electrical, and optical characterizations were investigated. The results of XRD patterns showed the amorphous structure of AZO thin films. FE-SEM images illustrated the increase of grain size by increasing annealing temperature up to 500oC. The reflectance analysis showed that for this annealing temperature, that the energy band gap of AZO thin film was moved to higher energy level. The electrical properties were investigated by I–V measurement carried out in the light at room temperatures. The short circuit current (ISC), ideality factor, saturation current, and open circuit voltage (VOC) of the AZO/p-Si heterojunction strongly depended on annealing conditions due to charge carrier trapping and density of defect on interface. By considering IR and IF as reverse and forward current, the ration of IF/IR had the maximum value at 1 V which was belonged to n-AZO/p-Si heterojunction at 500oC annealing temperature.

STUDY OF THE COMPOSITION OF GaAsBi FILMS OBTAINED BY PULSED LASER

Методом одноосного холодного прессования были изготовлены мишени GaAsBi с содержанием Bi 1 и 22%. Из полученных мишеней впервые было проведено импульсное лазерное напыления тонких пленок GaAsBi на подложках GaAs и Si. Были исследованы состав, спектры комбинационного рассеяния и фотолюминесценции тонких пленок GaAsBi, полученных из мишеней с содержанием Bi 1 и 22%. По данным спектров фотолюминесценции тонких пленок GaAsBi на подложках GaAs определено, максимальное содержание Bi в пленках не превышает 2,7 %. Полученные результаты хорошо коррелируют с результатами энергодисперсионного анализа, состав пленок, полученных из мишеней с содержанием Bi 1 и 22% - GaAs Bi и GaAsBi. Установлено, что фононная мода LO (GaBi). связанная с нарушением упорядоченности при смешении фаз GaAs и GaBi, находиться на частоте 181 см. Для тонкой пленки, полученной на подложке Si наблюдалась мода LO (GaAs), которая менее выражена и смещена на 3 см влево, в то время как запрещенная правилами отбора мода TO (GaAs) имеет более высокую интенсивность и ее смещение составляет около 1 см относительно частоты TO (GaAs) моды тонкой пленки, полученной на подложке GaAs . Uniaxial cold pressing was used to fabricate the GaAsBi targets with the Bi content of 1 and 22 %. From the obtained targets, pulsed laser deposition of GaAsBi thin films on the GaAs and Si substrates was carried out for the first time. We studied the composition, Raman and PL spectra of thin GaAsBi films obtained from targets with 1 and 22 % of Bi. According to the photoluminescence spectra of thin GaAsBi films on GaAs substrates, it was determined that the maximum content of Bi in the films did not exceed 2,7 %. The results obtained well correlate with the results of the energy dispersive analysis, the composition of films obtained from targets with the Bi content of 1 and 22% - GaAs Bi and GaAsBi. It was found that the LO(GaBi) phonon mode of associated with disordering during mixing of GaAs and GaBi phases to be at a frequency of 181 cm. For the thin film obtained on the Si substrate, the mode LO (GaAs) was observed that was less pronounced and shifted by 3 cm to the left, while the mode TO (GaAs), forbidden by the selection rules, had a higher intensity and its shift was of about 1 cm relative to the frequency of the mode TO (GaAs) of the thin film obtained on the GaAs substrate.