Hardness and Adhesion Measurements of Copper Metallizations by a Continuous Indentation Approach
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ABSTRACTA continuous indentation test has been used to evaluate the difference in adhesion between copper films deposited on oxidized silicon substrates with different transition metalinterlayers. Variations in adhesion between samples with interlayers of Al,Cr,Ni,Ti and V correlated with the free energy of formation of the particular metal oxide present.
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1933 ◽
Vol 55
(2)
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pp. 552-555
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1990 ◽
Vol 163
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pp. 109-113
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1990 ◽
Vol 158
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pp. 191-198
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1938 ◽
Vol 42
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pp. 317-333
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