Structural Characterization of Dynamic Annealing Effects of P+ Implanted SI

1985 ◽  
Vol 45 ◽  
Author(s):  
Marina Berti ◽  
A.V. Drigo ◽  
E. Gabilli ◽  
R. Lotti ◽  
G. Lulli ◽  
...  

ABSTRACTSome renarks about the mechanism for dynamic annealing during high dose rate P implantation of Si are reported. TEM observations and RBS channeling measurements show that the ion bombardment enhances the amorphous to crystalline transformation in the temperature range 200 ≤ T ≤ 600°C. It is found that the ratio between the observed recrystalli-zation velocity and the thermal SPE velocity decreases with increasing temperature. This indicates that a transition temperature must exist between the ion-assisted recrystallization regime and the ?lermal SPE regime. For the energy (100 keV) and the dose rate (60,uA/cm2) used in our experiments the transition temperature is about 700°C.

2020 ◽  
Vol 47 (5) ◽  
pp. 2242-2253 ◽  
Author(s):  
Samuel Ruiz‐Arrebola ◽  
Rosa Fabregat‐Borrás ◽  
Eduardo Rodríguez ◽  
Manuel Fernández‐Montes ◽  
Mercedes Pérez‐Macho ◽  
...  

2012 ◽  
Vol 39 (6Part14) ◽  
pp. 3777-3777 ◽  
Author(s):  
A Heredia ◽  
A Robinson ◽  
D Henderson ◽  
B Thomadsen

2016 ◽  
Vol 43 (4) ◽  
pp. 1639-1648 ◽  
Author(s):  
C. Candela-Juan ◽  
Y. Niatsetski ◽  
R. van der Laarse ◽  
D. Granero ◽  
F. Ballester ◽  
...  

1980 ◽  
Vol 1 ◽  
Author(s):  
J.S. Williams ◽  
A. P. Pogany ◽  
D. G. Beanland ◽  
D. J. Chivers ◽  
M. J. Kenny ◽  
...  

ABSTRACTHigh resolution Rutherford backscattering and channelling TEM and electrical measurements have been employed to investigate pulsed-ruby laser annealing effects in high dose rate ion implanted silicon wafers. The laterally non-uniform, part amorphous, part crystalline disordered structure which can result from high dose rate implants has been utilized to investigate the selective removal of amorphous or crystalline damage at near-threshold laser powers. Evidence is found for preferrential recrystallisation of amorphous damage regions over a broad laser power window which is below the threshold power required to melt adjacent crystalline silicon. At laser power levels above the crystalline-to-melt threshold, excellent uniformity in damage removal and electrical properties were obtained over the entire wafer.


2015 ◽  
Vol 42 (6Part14) ◽  
pp. 3369-3370
Author(s):  
I Buzurovic ◽  
J Hansen ◽  
M Bhagwat ◽  
D O'Farrell ◽  
A Damato ◽  
...  

2019 ◽  
Vol 58 ◽  
pp. 1-7 ◽  
Author(s):  
Zulaikha Jamalludin ◽  
Wei Loong Jong ◽  
Rozita Abdul Malik ◽  
Anatoly Rosenfeld ◽  
Ngie Min Ung

2017 ◽  
Vol 6 (S5) ◽  
pp. S761-S768 ◽  
Author(s):  
Paola Scampoli ◽  
Carmela Carpentieri ◽  
Marco Giannelli ◽  
Vera Magaddino ◽  
Lorenzo Manti ◽  
...  

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