Three-Dimensional Finite Element Simulation of Electro and Stress Migration Effects in Interconnect Lines
Keyword(s):
ABSTRACTA tool for 3-D modeling of EM and SM in interconnect lines has been developed based on a commercial finite element code. After detailing the approach, we focus on the verification of the simulator by comparing the results of 1-D analytic and FEM simulations, and then we apply the simulator to interconnect line segments with a specified grain structure.
2013 ◽
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