Fracture Tests Of Polysilicon Film
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ABSTRACTA new test approach is presented to measure the fracture toughness of thin films. The polysilicon specimen is a center-cracked panel that is 3.5 μm thick and 3 mm wide with a 100 μm long slot in the center. It is subjected to tensile loading, and the crack-opening displacement is measured by interferometry. The average toughness is 1.4 ± 0.65 MPa-m1/2.
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2006 ◽
Vol 73
(5)
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pp. 571-582
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1976 ◽
Vol 98
(3)
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pp. 213-213
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1989 ◽
Vol 15
(2)
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pp. 71-77
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