Photonic Bandgap Formation by Wafer Bonding and Delamination

A new approach for one-dimensional photonic bandgap formation is introduced. The method consists of wafer bonding and delamination, which is capable of stacking single crystalline semiconductor layers on non-crystalline insulator layers. Si and SiO2 layers with sub-wavelength periodicity are successfully stacked to form photonic crystals consisting of 3 pairs without a defect layer and of 4.5 pairs with a defect layer. The transmittance spectra are well reproduced by transfer matrix calculations. This clearly verifies the potential of the wafer bonding and delamination method.