Nanoscale structuring is a promising area in which the various processing methods are being developed. Based on the advantages of laser processing, associated with improved self-assembly technique, it is very effective to fabricate nanoscale structures, such as 3-D photonic bandgap structures, especially on the materials with high hardness and high melting point. This new approach to fabricating 3-D photonic bandgap structures on silicon will be presented. Self-assembly technique was used to deposit multi-layer of silica microparticles with a size of 0.81 μm. A pulsed KrF excimer laser (23 ns, 248 nm) was applied as the imprinting energy source.
Back-to-back substrate wafer bonding: A new approach to the fabrication of double-side coated wafers
