Characteristic Properties of the Mathematical Modeling of the Temperature Conditions of Printed Board Assemblies under Individual Gas Soldering of Electronic Components

1998 ◽  
Vol 29 (1-3) ◽  
pp. 132-139
Author(s):  
V. G. Sarioglo ◽  
N. M. Fialko ◽  
V. G. Prokopov
2011 ◽  
Vol 55-57 ◽  
pp. 2206-2209
Author(s):  
Jian Jun Xu ◽  
Ya Zhang ◽  
Bo Li

Military electronic components apply in high temperature conditions has become one of the hot research field of reliability field, then the temperature characteristics of the military electronic components are known by designers is key to guarantee high reliability of military equipment under high temperature conditions. So, a scheme of the high temperature dynamic test based on low consumed power test circuits and PC is worked out in this paper. It can be used for test the temperature performance of the military electronic components, and feasibility of the schemes are tested and verified by experiment. And the changing law of the components parameter are got in this conditions which found out components parameters approximate linear in 25°C~200°C, of nonlinear in large range in the very high temperature of 200°C~350°C conditions, which can offer some reference value to prolong lifetime of military electron device.


2015 ◽  
Vol 46 (S 01) ◽  
Author(s):  
R. Lampe ◽  
N. Botkin ◽  
V. Turova ◽  
T. Blumenstein ◽  
A. Alves-Pinto

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