scholarly journals Determination of Thermal Induced Stresses in Semiconductor Chip Package by using Finite Element Analysis: A Brief Review

Author(s):  
Shantanu Patil ◽  
Govind Waghmare ◽  
2016 ◽  
Vol 24 ◽  
pp. 4083-4097 ◽  
Author(s):  
Ab Halim ABU BAKAR ◽  
Alyaa ZAINAL ABIDIN ◽  
Hazlee Azil ILLIAS ◽  
Hazlie MOKHLIS ◽  
Syahirah ABD HALIM ◽  
...  

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