Determination of Thermal Induced Stresses in Semiconductor Chip Package by using Finite Element Analysis: A Brief Review
Shantanu Patil
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Govind Waghmare
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2021 ◽
Vol 92
(4)
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pp. 045001
Jorge Rodriguez-Ramos
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Felix Rico
U. B Ikponmwosa
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E Nwankwo
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K. O Bello
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A. O Olafuyi
2015 ◽
Vol 42
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pp. 10-18
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Chen-Yuan Chung
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Joseph M. Mansour
2015 ◽
Vol 138
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pp. 118-126
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Qinghua Han
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Yaru Wang
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Yue Yin
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Danni Wang
2016 ◽
Vol 24
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pp. 4083-4097
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Ab Halim ABU BAKAR
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Alyaa ZAINAL ABIDIN
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Hazlee Azil ILLIAS
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Hazlie MOKHLIS
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Syahirah ABD HALIM
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...
2000 ◽
Vol 14
(4)
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pp. 401-407
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2018 ◽
Vol 19
(2)
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pp. 131-145
S. J. Fatemi
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A. H. Sheikh
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M. S. Mohamed Ali
2012 ◽
Vol 36
(5)
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pp. 529-535
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Ji-Won Jin
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Sung-Jong Kwak
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Tae-Seong Kim
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Ki-Han Noh
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Ki-Weon Kang
Tianmin Guan
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Yufang Zhang
◽
Adeel Anwar
◽
Yufen Zhang
◽
Lina Wang