scholarly journals Source wave analysis of large amplitude acoustic emission in the breaking of glue lines.

1987 ◽  
Vol 43 (12) ◽  
pp. 637-643
Author(s):  
Tetsuya Nakao
2002 ◽  
Vol 35 (3) ◽  
pp. 137-146 ◽  
Author(s):  
Sébastien Grondel ◽  
Christophe Delebarre ◽  
Jamal Assaad ◽  
Jean-Pierre Dupuis ◽  
Livier Reithler

1988 ◽  
Vol 37 (416) ◽  
pp. 565-570 ◽  
Author(s):  
Tetsuya NAKAO ◽  
Chiaki TANAKA ◽  
Akira TAKAHASHI

2021 ◽  
Vol 410 ◽  
pp. 841-846
Author(s):  
Valentina I. Loganina

Information on deformation of coatings at different loading levels during peeling is given. It is shown that the deformations of the organosilicon coating appear already at the initial stages of loading, and the obtained data correlate with the data on acoustic emission. For a polyvinyl acetate coating at low loading levels, equal to 0.3-0.4 R, the release of acoustic signal energy is not observed. The absence of signals with a large amplitude at loading levels up to 0.7-0.8 R indicates the development of plastic deformations in the contact zone of the coating with the substrate. It was found that early localization of bond breaking in the contact zone, leading to the formation of a fracture focus, occurs in organosilicon coatings KO-168. For PVAC coatings, an abrupt growth of cracks is characteristic, which is preceded by its slow growth. The pseudoplastic mechanism of destruction of PVAC coatings has been established. The influence of the nature of the substrate on the change in the nature of the peeling of the coatings is considered.


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