Chemicals Industry New Process Chemistry Roadmap

2000 ◽  
Author(s):  
none,
1999 ◽  
Vol 564 ◽  
Author(s):  
Chan-Lon Yang ◽  
Tong-Yu Chen ◽  
Keh-Ching Huang ◽  
Le-Tien Jung ◽  
Tsu-An Lin ◽  
...  

AbstractFor embedded DRAM (E-DRAM) devices with feature sizes of 0.25 µm and beyond, contact processes with low contact resistance and low junction leakage current are required. The contact etch process needs to etch through multi-layer structures with SiO2, SiON/SiN layers and stop on Ti-polycide gate and Ti-salicide active regions at the same time. The key issues include high selectivity to TiSix, vertical profile, complete removal of SiON/SiN cap layer and no polymer residues. In this paper, multi-layer contact etching without attacking TiSix is reported. Using new process chemistry, the new contact etch process has been demonstrated for the manufacturing of 0.25 µm E-DRAM and beyond.


1916 ◽  
Vol 114 (9) ◽  
pp. 225-225
Author(s):  
Robert G. Skerritt
Keyword(s):  

1919 ◽  
Vol 120 (25) ◽  
pp. 650-651
Author(s):  
E. F. Cone
Keyword(s):  

2020 ◽  
Vol 6 (1) ◽  
Author(s):  
Lance Clarence ◽  
Wan Muhammad Noor Sarbani Mat Daud

In the competition among organization on the global market, no organization will tolerate losses. Overall Equipment Effectiveness (OEE) overall is a new process in which the efficiency of a system is calculated and complicated manufacturing issues are truly simplified to simple and intuitive knowledge delivery. It thinks about the exceptionally important measures of productivity. An endeavour has been done to measure and analyse existing Overall Equipment Effectiveness (OEE) at company Kirino in hope to reduce unplanned downtime losses on equipment failure and tooling damage to maximize the productivity. The methods used to analyse these various causes were analysis tools and Intelligence Systems. After knowing the causes of various activities that leads to high rates of defects, then recommendations for improvements that could be used by company Kirino were ready to be made using intelligent system as a medium of solution


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