The Micro Motion of Ambient Surrounding – An Exploration of Techno-biophilic Design

Author(s):  
Tzu-Yao Yang ◽  
June-Hao Hou
2010 ◽  
Vol 32 (11) ◽  
pp. 2630-2635
Author(s):  
Yong-sheng Guan ◽  
Qun-sheng Zuo ◽  
Hong-wei Liu

2016 ◽  
Vol 8 (1) ◽  
pp. 47-51
Author(s):  
Yanfei Zhang ◽  
Jinliang Gong ◽  
Tong Pei

2009 ◽  
Author(s):  
Yongsheng Guan ◽  
Hongwei Liu ◽  
Feng Chen

2021 ◽  
Author(s):  
Ismi Ibrahim ◽  
Rizal Khairuddin ◽  
Azli Abdullah ◽  
Izzati M Amin ◽  
Julaihi Wahid

2021 ◽  
Vol 30 ◽  
pp. 2633366X2098530
Author(s):  
Shiyang Yu ◽  
Shijun Ji ◽  
Ji Zhao ◽  
Chao Zhang ◽  
Handa Dai

The main factors affecting the displacement of micro-motion platform during the grinding process are spindle speed, cutting force, and piezoelectric ceramic input voltage model. This article, using the orthogonal test method, found a set of machining parameters which lead to less displacement deviation between practical test and theoretic analysis. First of all, single-factor experiments were carried out to study how spindle speed, cutting force, and piezoelectric ceramic input voltage model affect the experimental results, and then the orthogonal test was conducted. The experimental datum shows that voltage model was the most influential factor, followed by spindle speed and cutting force. The optimum combination of grinding parameters was obtained as spindle speed of 800 r/min, cutting force of 18 N, and voltage model radius of 12 µm. At this time, the average unit error of displacement of micro-motion platform was 9.13%.


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