scholarly journals Noise Elimination for Image Subtraction in Printed Circuit Board Defect Detection Algorithm

2013 ◽  
Vol 10 (2) ◽  
pp. 1317-1329
Author(s):  
Zuwairie Ibrahim ◽  
Ismail Ibrahim ◽  
Kamal Khalil ◽  
Sophan Wahyudi Nawawi ◽  
Muhammad Arif Abdul Rahim ◽  
...  
Keyword(s):  
Image Registration ◽  
Visual Inspection ◽  
Printed Circuit Board ◽  
Detection Algorithm ◽  
Circuit Board ◽  
Automated Visual Inspection ◽  
Noise Elimination ◽  
Image Subtraction ◽  
Printed Circuit ◽  
Thresholding Algorithm

Image subtraction operation has been frequently used for automated visual inspection of printed circuit board (PCB) defects. Even though the image subtraction operation able to detect all defects occurred on PCB, some unwanted noise could be detected as well. Hence, before the image subtraction operation can be applied to real images of PCB, image registration operation should be done to align a defective PCB image against a template PCB image. This study shows how the image registration operation is incorporated with a thresholding algorithm to eliminate unwanted noise. The results show that all defects occurred on real images of PCB can be correctly detected without interfere by any unwanted noise.

scholarly journals Implementasi Adaptive Neural Fuzzy Inference System (ANFIS) Untuk Menguji Kualitas Printed Circuit Board (PCB)

2021 ◽  
Vol 5 (2) ◽  
pp. 79-90
Author(s):  
Tatang Rohana Cucu
Keyword(s):  
Visual Inspection ◽  
Printed Circuit Board ◽  
Fuzzy Inference ◽  
Circuit Board ◽  
Inspection System ◽  
Automated Visual Inspection ◽  
Inference System ◽  
Printed Circuit ◽  
Bahasa Indonesia ◽  
Neural Fuzzy

Pengujian kualitas menggunakan teknik pengolahan citra dan kecerdasan tiruan banyak diterapkan dalam berbagai industri, misalnya industri tekstil, perakitan kendaraan, makanan, minuman, perakitan elektronik, dan lain – lain. Pengujian model ini sering disebut dengan istilah Automated Visual Inspection System (AVIS) atau dalam bahasa Indonesia Sistem Inspeksi Visual Otomatis (SIVO). Penelitian ini mengacu pada model sistem inspeksi, di mana objek pengujiannya adalah keping Printed Circuit Board (PCB). Banyak penelitian tentang pengujian PCB yang sudah dilakukan, tetapi masih banyak yang belum memberikan hasil yang optimum, diantaranya waktu akses yang masih lambat, keakuratan data masih rendah, dan tingkat kesalahan yang masih tinggi. Berdasarkan hasil penelitian dan pengujian yang sudah dilakukan, model ANFIS sangat layak dijadikan sebagai model inferensi kecerdasan buatan dalam sistem yang berbasis inspeksi otomatis khususnya menguji kualitas keping PCB, karena terbukti model ANFIS dengan model hybrid trapesium mf memiliki tingkat kesalahan yang sangat kecil yaitu 4.0186e-007 dan untuk tingkat akurasi pengujian datanya mencapai 99%. 

Three Dimensional Detection of the via in the PCB CT Image Using Morphology Operation

2015 ◽  
Vol 752-753 ◽  
pp. 1406-1412
Author(s):  
Lei Zeng ◽  
Jian Chen ◽  
Han Ning Li ◽  
Bin Yan ◽  
Yi Fu Xu ◽  
...  
Keyword(s):  
Nondestructive Testing ◽  
Printed Circuit Board ◽  
Three Dimensional ◽  
Detection Algorithm ◽  
Circuit Board ◽  
Dimensional Structure ◽  
Three Dimension ◽  
Shape Information ◽  
Printed Circuit ◽  
Testing Technology

In modern industry, the nondestructive testing of printed circuit board (PCB) can prevent effectively the system failure and is becoming more and more important. As a vital part of the PCB, the via connects the devices, the components and the wires and plays a very important role for the connection of the circuits. With the development of testing technology, the nondestructive testing of the via extends from two dimension to three dimension in recent years. This paper proposes a three dimensional detection algorithm using morphology method to test the via. The proposed algorithm takes full advantage of the three dimensional structure and shape information of the via. We have used the proposed method to detect via from PCB images with different size and quality, and found the detection performances to be very encouraging.

A Comparison of Image Registration Methods Used for Printed Circuit Board Inspection

2008 ◽  
Vol 381-382 ◽  
pp. 295-298
Author(s):  
Shin Chieh Lin ◽  
C.T. Chen ◽  
C.H. Chou
Keyword(s):  
Image Registration ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Loading Test ◽  
Area Method ◽  
Printed Circuit ◽  
Feature Based ◽  
Position And Orientation ◽  
Inspection Machine

In this study, registration methods used to estimate both position and orientation differences between two images had been evaluated. This is an important issue since that there are always some position and orientation differences when loading test samples on the inspection machine. These differences should be calculated and compensated before further analysis. Registration methods tested including one area method and three feature based method. It was shown that the area method had better performance than other feature based method in these cases studied. And it is shown that it is much easy to detect defect by analyzing the subtracted image with position and orientation compensation instead of those without compensation.

Analysis of Fractures of Printed Circuit Board Traces

2012 ◽  
Author(s):  
Carl Nail ◽  
Larry Rice
Keyword(s):  
Crack Initiation ◽  
Fatigue Failure ◽  
Visual Inspection ◽  
Printed Circuit Board ◽  
Fracture Analysis ◽  
Circuit Board ◽  
Printed Circuit ◽  
Solder Mask ◽  
Cracking Mechanism

Abstract A PCB trace was repeatedly cracking in the same location. Visual inspection showed cracking there and at structurally similar locations, with solder mask missing from one side of the trace of interest. Fracture analysis suggested that these issues and etch pitting caused crack initiation, followed by fatigue failure that ultimately led to full fracture. A FIB section of a second failure reinforced the finding that the fundamental cracking mechanism was fatigue.

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