AbstractIn this paper, we propose a theoretical framework for studying mixed mode (I and II) creep crack growth under steady state creep conditions. In particular, we focus on the problem of creep crack growth along an interface, whose fracture properties are weaker than the bulk material, located either side of the interface. The theoretical framework of creep crack growth under mode I, previously proposed by the authors, is extended. The bulk behaviour is described by a power-law creep, and damage zone models that account for mode mixity are proposed to model the fracture process ahead of a crack tip. The damage model is described by a traction-separation rate law that is defined in terms of effective traction and separation rate which couple the different fracture modes. Different models are introduced, namely, a simple critical displacement model, empirical Kachanov type damage models and a micromechanical based model. Using the path independence of the $$C^{*}$$
C
∗
-integral and dimensional analysis, analytical models are developed for mixed mode steady-state crack growth in a double cantilever beam specimen (DCB) subjected to combined bending moments and tangential forces. A computational framework is then implemented using the Finite Element method. The analytical models are calibrated against detailed Finite Element models and a scaling function ($$C_{k}$$
C
k
) is determined in terms of a dimensionless quantity $$\phi _{0}$$
ϕ
0
(which is the ratio of geometric and material length scales), mode mixity $$\chi $$
χ
and the deformation and damage coupling parameters. We demonstrate that the form of the $$C_{k}$$
C
k
-function does not change with mode mixity; however, its value depends on the mode mixity, the deformation and damage coupling parameters and the detailed form of the damage zone. Finally, we demonstrate how parameters within the models can be obtained from creep deformation, creep rupture and crack growth experiments for mode I and II loading conditions.
Mixed Mode Delamination Creep Crack Growth of Unidirectionally Reinforced AS4/PEEK Laminate at Elevated Temperature.