scholarly journals Effects of Loading Rate on the Crack Growth Behavior of Adhesively Bonded CFRP Joints with a Structural Film Adhesive

2018 ◽  
Vol 67 (4) ◽  
pp. 438-444
Author(s):  
Sota OSHIMA ◽  
Hisayoshi ISHIDA ◽  
Yongsik CHOO ◽  
Takayuki KUSAKA ◽  
Tomo TAKEDA
2017 ◽  
Vol 2017.92 (0) ◽  
pp. M805
Author(s):  
Hafizzy YUSOP ◽  
M. Azrul Hadi GHAZALI ◽  
Takayuki KUSAKA

Author(s):  
Yoichi Takeda ◽  
Hirofumi Sato ◽  
Shuhei Yamamoto ◽  
Takamichi Tokunaga ◽  
Akio Ohji

Advanced ultra supercritical (A-USC) steam power generation, in which high-pressure steam is raised to beyond 700°C, is being studied internationally. The creep strength of Ni-based super alloys evaluated at these high temperatures in an air environment makes these materials promising candidates for the material to be used for the structural components of these generators. Since they are exposed to high temperature steam, it is important that the effect of the environment on the degradation of these materials is investigated. In this investigation, the crack growth rate under cyclic loading in a 750°C steam environment using a compact tension specimen was evaluated. Crack length monitoring using the direct current potential drop technique was applied to the growing crack in a high temperature environment in order to evaluate the time-dependent behavior of the crack growth. The dependence of the loading rate and amplitude in terms of the stress intensity factor was obtained. The crack growth rate increased with decreasing loading rate and increasing amplitude. Multiple loading patterns were applied to a single specimen during crack length monitoring. When the loading pattern was changed to a different pattern, in most of the cases, the crack growth rate started to change and then became stable aftera transition period. The influence of intermetallics and different phases on the crack growth behavior is discussed based on the oxidation rate of these phases.


2016 ◽  
Vol 715 ◽  
pp. 116-121 ◽  
Author(s):  
Sota Oshima ◽  
Hisayoshi Ishida ◽  
Ryota Tanegashima ◽  
Takayuki Kusaka ◽  
Tomo Takeda

A novel experimental method has been developed to evaluate the mode I crack growth behavior of adhesively bonded joints under impact loading. The split Hopkinson pressure bar (SHPB) technique and the digital image correlation (DIC) technique was employed to evaluate the crack growth behavior. To reduce the dynamic effects by controlling loading input of the SHPB apparatus, the fracture toughness was determined precisely based on static evaluation formula. To contrive the testing set-up, high loading rate was kept until the arrest of crack. The fracture toughness of titanium alloy/epoxy adhesively bonded joints during crack propagation was obtained successfully by using present method.


1978 ◽  
Vol 100 (1) ◽  
pp. 46-51 ◽  
Author(s):  
M. M. Ratwani

Problems of adherend cracks inadhesively bonded structures are considered in this paper. Two different methods of analysis, namely the finite element method and the integral equation approach, are used to obtain the stress intensity factors, which are compared with those obtained experimentally. The results of fatigue crack growth tests on two-ply, adhesively bonded panels with a width of 300 mm and 150 mm, a crack at a hole, and a cracked plate with a bonded stiffener are discussed. Fatigue crack growth behavior predictions based on the analytical stress intensity factors are correlated with those obtained from experiments for a variety of test geometries. The influence of adhesive type, adhesive thickness, and stiffener thickness on crack growth behavior are discussed for the case of a cracked plate with a bonded stiffener.


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