Study of inhomogeneous fields of residual stresses using step-by-step enlarged crack method in combination with electronic speckle pattern interferometry (ESPI)

2021 ◽  
Vol 87 (9) ◽  
pp. 50-58
Author(s):  
S. M. Usov ◽  
I. A. Razumovsky ◽  
I. A. Odintsev
Keyword(s):  
Residual Stresses ◽  
Crack Length ◽  
Speckle Pattern ◽  
Structural Heterogeneity ◽  
Initial Position ◽  
Electronic Speckle Pattern Interferometry ◽  
Displacement Fields ◽  
Deformation Response ◽  
Gradient Fields ◽  
High Level

This article covers the development of methodological issues, software, experimental equipment, and practical application of the method of sequentially increasing cracks for studying inhomogeneous high-gradient fields of residual stresses (RS) that occur in areas of structural heterogeneity in flat construction parts (e.g., welded joints). Method of electronic speckle pattern interferometry (ESPI) is used to detect the deformation response in the form of the fields of displacement of the surface of the object under study arising from formation of successively increasing crack. ESPI provide contactless registration of movements directly in a digital form with high accuracy. The scheme of a specialized interferometer is described along with the features of the procedure for registering the displacement fields arising from a stepwise increase of the crack length. A return device provided removing of the object under study out of the optical zone and then return it to the initial position after performing the necessary mechanical operations. The accuracy of the procedure for calculating RS is estimated on the basis of mathematical processing of the experimentally obtained dependences of SIF on the crack length. An example of using the developed methods, equipment and programs for studying the RS distribution in stir welding joint of the sheets of aircraft alloy 1163T with a high level of crack resistance is given.

Electronic Speckle Pattern Interferometry Applied to the Displacement Measurement of Sandwich Plates with Single ‘Fully Potted’ Insert

2004 ◽  
Vol 20 (4) ◽  
pp. 273-276 ◽  
Author(s):  
S. J. Huang ◽  
H. L. Lin
Keyword(s):  
Speckle Pattern ◽  
Fem Analysis ◽  
Electronic Speckle Pattern Interferometry ◽  
Sandwich Plates ◽  
Destructive Testing ◽  
Displacement Fields ◽  
Full Field ◽  
Out Of Plane ◽  
Plane Displacement ◽  
Non Destructive

AbstractThe construction and operation of electronic speckle pattern interferometer (ESPI) applied to single-inserted sandwich plates have been earliest presented in this paper. Proposed ESPI has advantages of full-field and non-destructive testing, which can measures microscopic out-of-plane displacement in the elastic region without wasting specimen. For validation purpose, the finite element method (FEM) analysis was conducted. By comparing the results of ESPI and FEM displacement fields around the inserts that a convincing agreement is revealed. The effect of potting material diameter on the displacement of single-inserted sandwich plates was obtained by the ESPI and FEM.

Modeling and Measurement of Residual Stresses along the Process Chain of Autofrettaged Components by Using FEA and Hole-Drilling Method with ESPI

2013 ◽  
Vol 768-769 ◽  
pp. 79-86 ◽  
Author(s):  
Horst Brünnet ◽  
Dirk Bähre ◽  
Theo J. Rickert ◽  
Dominik Dapprich
Keyword(s):  
Residual Stress ◽  
Stress Distribution ◽  
Residual Stresses ◽  
Speckle Pattern ◽  
Residual Stress Distribution ◽  
Electronic Speckle Pattern Interferometry ◽  
Hole Drilling ◽  
Element Analysis ◽  
Hole Drilling Method ◽  
Drilling Method

The incremental hole-drilling method is a well-known mechanical measurement procedure for the analysis of residual stresses. The newly developed PRISM® technology by Stresstech Group measures stress relaxation optically using electronic speckle pattern interferometry (ESPI). In case of autofrettaged components, the large amount of compressive residual stresses and the radius of the pressurized bores can be challenging for the measurement system. This research discusses the applicability of the measurement principle for autofrettaged cylinders made of steel AISI 4140. The residual stresses are measured after AF and after subsequent boring and reaming. The experimental residual stress depth profiles are compared to numerically acquired results from a finite element analysis (FEA) with the software code ABAQUS. Sample preparation will be considered as the parts have to be sectioned in half in order to access the measurement position. Following this, the influence of the boring and reaming operation on the final residual stress distribution as well as the accuracy of the presented measurement setup will be discussed. Finally, the usability of the FEA method in early design stages is discussed in order to predict the final residual stress distribution after AF and a following post-machining operation.

Determining Residual Stresses in Weld Joints of DN 850 Pipes by Spot Drilling Combined with Electronic Speckle Pattern Interferometry

2021 ◽  
Vol 410 ◽  
pp. 366-371
Author(s):  
Igor N. Odintsev ◽  
Taras P. Plugatar ◽  
Andrey A. Apalkov
Keyword(s):  
Residual Stresses ◽  
Weld Joint ◽  
Speckle Pattern ◽  
Joint Implementation ◽  
Field Conditions ◽  
Electronic Speckle Pattern Interferometry ◽  
Weld Joints ◽  
Study Results ◽  
Drilling Technique ◽  
And Performance

Residual welding stresses affect significantly the strength, durability, and performance of structures. Therefore, there is an urgent need for developing and implementing techniques and equipment that allow reliably estimating stresses in experiments. This paper considers some aspects of the joint implementation of electronic speckle pattern interferometry and the spot drilling technique to determine these characteristics under the field conditions. The results of determining the distribution of residual stresses in the weld joint areas of DN 850 pipes are given for various welding modes. The study results are of independent significance and herewith, demonstrate the efficiency of the equipment developed to solve similar problems.

Double wavelength combined electronic speckle pattern interferometry–moiré system for full-field strain analysis on electronic components

2018 ◽  
Vol 53 (6) ◽  
pp. 379-388
Author(s):  
Caterina Casavola ◽  
Giovanni Pappalettera
Keyword(s):  
Speckle Pattern ◽  
Strain Analysis ◽  
Thermal Dissipation ◽  
Electronic Speckle Pattern Interferometry ◽  
Systematic Bias ◽  
Electronic Components ◽  
Displacement Fields ◽  
Field Methods ◽  
Full Field ◽  
Set Up

Determination of thermal dissipation capability and thermomechanical behavior of electronic components is becoming a relevant topic in view of the fact that thermal management can strongly affect reliability and lifetime of the component. The level of miniaturization, which is achieved in current electronics, requires that no-contact analysis must be privileged in view of the fact that any contact with the chip can significantly alter the heat capacity of the component and to introduce a systematic bias in the measurements. Moreover, the high complexity of electronics components suggests that full-field methods should be adopted in order to take into account about differences in terms of thermomechanical response in different areas of the same sample. In this article, an original optical set-up including a speckle interferometer and a projection moiré branch was developed; this system comprises two different laser sources emitting at two different wavelengths. Recording by a color camera allows detecting simultaneously the speckle pattern and the projected fringes. The whole information is successively separated in the post-processing stage and this allows obtaining in-plane and out-of-plane displacement fields. The system demonstrated its capability to determine dynamic response of the LM1084 analyzed component and, moreover, to detect the presence of a functional damage.

A Study on Measurement of Welding Residual Stress Using ESPI System

2006 ◽  
Vol 324-325 ◽  
pp. 859-862 ◽  
Author(s):  
Kyung Su Kim ◽  
Seung Bok Choi ◽  
Jang Hyun Lee ◽  
Seong Mo Park ◽  
Beom Il Kim ◽  
...  
Keyword(s):  
Residual Stresses ◽  
Speckle Pattern ◽  
Three Dimensional ◽  
Welding Residual Stress ◽  
Electronic Speckle Pattern Interferometry ◽  
Fe Model ◽  
Analysis Model ◽  
Element Analysis ◽  
The Difference ◽  
Welding Procedure

In this study, an experimental method has been studied to measure the residual stresses on a specimen with I-groove weldment. The specimens were extracted from I-groove weldment which was joined by SAW (Submerged Arc Welding) with CO2 shield gas. A FEA (Finite Element Analysis) model was developed for the estimation of the residual stresses for the specimen. Measurements were carried out using ESPI(Electronic Speckle Pattern Interferometry) system which can measure the strain distribution on the surface of specimen. The residual stresses were estimated by the value of strain measured by ESPI system. Strain gages were added to evaluate the accuracy of ESPI system. In addition, a three-dimensional FE model was used to estimate the residual stresses generated by the welding procedure. A thermal elasto-plastic analysis was performed by the FEA. The stresses measured by the experiments were compared with the results of FEA. Also, discussed are the difference and agreement between the stresses obtained by experiments and FEA, respectively.

A new Approach in Residual Stresses Analysis by Speckle Interferometry

2006 ◽  
Vol 524-525 ◽  
pp. 465-470 ◽  
Author(s):  
Afaf Maras ◽  
Guillaume Montay ◽  
Olivier Sicot ◽  
Emmanuelle Rouhaud ◽  
Manuel François
Keyword(s):  
Residual Stresses ◽  
Speckle Pattern ◽  
Speckle Interferometry ◽  
Electronic Speckle Pattern Interferometry ◽  
Stress Profile ◽  
Reliable Prediction ◽  
New Approach ◽  
Ultrasonic Shot Peening ◽  
Internal Stress Field ◽  
Fringe Patterns

The knowledge of residual stresses allows a reliable prediction of structure performances evolution, such as service life [1-3]. In this paper, we develop a new method for residual stresses determination combining Electronic Speckle Pattern Interferometry (ESPI) with the machining of a groove. The internal stress field is perturbed as the depth of the groove is increased incrementally. The structure finds a new equilibrium state generating displacements which are measured using ESPI. This method was tested on an aluminium alloy AU4G plate treated locally by an ultrasonic shot-peening. The investigation of the images obtained with the phase shifting technique and fringe patterns, makes it possible to analyze, simultaneously, the stress profile along two directions: along the depth of the structure, and along the groove direction.

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