scholarly journals IMPLEMENTATION OF ROOT CAUSE ANALYSIS METHOD TO INVESTIGATE FAILURE OF FRONT WALL TUBE BOILER

2021 ◽  
Vol 14 (3) ◽  
Author(s):  
Eka Febriyanti ◽  
Amin Suhadi ◽  
Laili Novita Sari
Keyword(s):  
Hardness Test ◽  
Root Cause Analysis ◽  
Front Wall ◽  
Visual Test ◽  
Cause Analysis ◽  
Root Cause ◽  
Eds Analysis ◽  
Examination Result ◽  
Cause Of Failure ◽  
Longitudinal Cracks

Root cause analysis is a method that observes on all of possible causes that can make the system or components fail. This research is implemented such method to investigate failed front wall tube on the boiler. The purpose of this research is to find out the main cause of failure on front wall tube in order to avoid similar problem in the future.  With considering all aspects that have potential to be the main cause of failure therefore,  many tests and examinations are done including visual test, fractography, metallography, chemical analysis, hardness test, SEM and EDS analysis.  Examination result on the fracture surface shows two bulges on a tube and some longitudinal cracks spread on bulges outside surface area. While thick scale is also found on inside surface of these bulges. Moreover microstructure and hardness changes are also found on this area.  From all of tests result that obtained it is concluded that the main cause of failure is the presence of scale that reduce heat transfer, so that local over heating occurred.  Consequently, its tensile strength in this area is decreased and finally tube could not support operational pressure and deformed to make bulge.     Root cause analysis is a method that observes on all of possible causes that can make the system or components fail. This research is implemented such method to investigate failed front wall tube on the boiler. The purpose of this research is to find out the main cause of failure on front wall tube in order to avoid similar problem in the future.  With considering all aspects that have potential to be the main cause of failure therefore,  many tests and examinations are done including visual test, fractography, metallography, chemical analysis, hardness test, SEM and EDS analysis.  Examination result on the fracture surface shows two bulges on a tube and some longitudinal cracks spread on bulges outside surface area. While thick scale is also found on inside surface of these bulges. Moreover microstructure and hardness changes are also found on this area.  From all of tests result that obtained it is concluded that the main cause of failure is the presence of scale that reduce heat transfer, so that local over heating occurred.  Consequently, its tensile strength in this area is decreased and finally tube could not support operational pressure and deformed to make bulge.     

Root Cause Analysis of Passenger Side Door System

2008 ◽  
Author(s):  
Wade Clark ◽  
Jeff Cook ◽  
Chris Madden
Keyword(s):  
Latent Root ◽  
Standard Operating Procedure ◽  
Root Cause Analysis ◽  
Obstacle Detection ◽  
Potential Hazard ◽  
Cause Analysis ◽  
Root Cause ◽  
Side Door ◽  
Productive Process ◽  
Cause Of Failure

This paper presents a real-world application of Root Cause Analysis methods that were applied to analyze and resolve a side door problem that was occurring on a particular fleet of coach cars operated by Amtrak. The foundation of a Root Cause Analysis program is a disciplined engineering process designed to identify physical, human and latent roots of chronic or sporadic problems. This paper presents the engineering challenges encountered while conducting root cause analysis of a complex coach car side doors problem. The coach car side doors system exhibited undesirable characteristics when in service. Mechanical staff received multiple reports that during station stops all of the open side doors would unexpectedly close even though the train speed was at zero. During this unexpected side door closing sequence all of the obstacle detection systems were disabled presenting a potential hazard to the traveling public. The side doors Root Cause Analysis team found the Physical Root cause of failure to be located in the door system software code — a finding that was never suspected following years of trouble with the side doors. As a result of this finding, the door manufacturer corrected the software and issued revised software to be installed fleet-wide. The Human and Latent Root causes were addressed through the development of a standard operating procedure and training for conductors and crew on the proper operation of side doors. The Root Cause Analysis method proved to be a powerful and productive process for achieving a solution to a chronic passenger side door problem.

Root Cause analysis of SG tube ODSCC indications within the tube sheets of NPP biblis unit A

2011 ◽  
pp. 78-86
Author(s):  
R. Kilian ◽  
J. Beck ◽  
H. Lang ◽  
V. Schneider ◽  
T. Schönherr ◽  
...  
Keyword(s):  
Root Cause Analysis ◽  
Cause Analysis ◽  
Root Cause

Rule Construction and its Execution for Root Cause Analysis

2012 ◽  
Vol 132 (10) ◽  
pp. 1689-1697
Author(s):  
Yutaka Kudo ◽  
Tomohiro Morimura ◽  
Kiminori Sugauchi ◽  
Tetsuya Masuishi ◽  
Norihisa Komoda
Keyword(s):  
Root Cause Analysis ◽  
Cause Analysis ◽  
Root Cause

Root Cause Analysis Techniques Using Picosecond Time Resolved LADA

2014 ◽  
Author(s):  
Dan Bodoh ◽  
Kent Erington ◽  
Kris Dickson ◽  
George Lange ◽  
Carey Wu ◽  
...  
Keyword(s):  
Integrated Circuits ◽  
Picosecond Laser ◽  
Root Cause Analysis ◽  
Fault Isolation ◽  
Time Resolved ◽  
Cause Analysis ◽  
Root Cause ◽  
Design And Manufacturing ◽  
Multiple Interactions ◽  
Established Technique

Abstract Laser-assisted device alteration (LADA) is an established technique used to identify critical speed paths in integrated circuits. LADA can reveal the physical location of a speed path, but not the timing of the speed path. This paper describes the root cause analysis benefits of 1064nm time resolved LADA (TR-LADA) with a picosecond laser. It shows several examples of how picosecond TR-LADA has complemented the existing fault isolation toolset and has allowed for quicker resolution of design and manufacturing issues. The paper explains how TR-LADA increases the LADA localization resolution by eliminating the well interaction, provides the timing of the event detected by LADA, indicates the propagation direction of the critical signals detected by LADA, allows the analyst to infer the logic values of the critical signals, and separates multiple interactions occurring at the same site for better understanding of the critical signals.

Root Cause Analysis for Pin Leakage

2016 ◽  
Author(s):  
Zhigang Song ◽  
Jochonia Nxumalo ◽  
Manuel Villalobos ◽  
Sweta Pendyala
Keyword(s):  
Failure Analysis ◽  
Root Cause Analysis ◽  
Advanced Technology ◽  
Process Step ◽  
Cause Analysis ◽  
Hard Mask ◽  
Technology Node ◽  
Root Cause ◽  
Tools And Techniques

Abstract Pin leakage continues to be on the list of top yield detractors for microelectronics devices. It is simply manifested as elevated current with one pin or several pins during pin continuity test. Although many techniques are capable to globally localize the fault of pin leakage, root cause analysis and identification for it are still very challenging with today’s advanced failure analysis tools and techniques. It is because pin leakage can be caused by any type of defect, at any layer in the device and at any process step. This paper presents a case study to demonstrate how to combine multiple techniques to accurately identify the root cause of a pin leakage issue for a device manufactured using advanced technology node. The root cause was identified as under-etch issue during P+ implantation hard mask opening for ESD protection diode, causing P+ implantation missing, which was responsible for the nearly ohmic type pin leakage.

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