Electrochemical Phase Formation of Metals and Alloys at Chemically Identical Solid or Liquid Cathode: Part 3. Alloys in the Form of Intermetallic Compounds

2020 ◽  
Vol 56 (4) ◽  
pp. 501-509
Author(s):  
O. B. Girin ◽  
D. G. Korolyanchuk
1983 ◽  
Vol 77 (3-4) ◽  
pp. 273-293 ◽  
Author(s):  
J. L. Brimhall ◽  
H. E. Kissinger ◽  
L. A. Charlot

1993 ◽  
Vol 8 (11) ◽  
pp. 2819-2829 ◽  
Author(s):  
M. Oehring ◽  
T. Klassen ◽  
R. Bormann

Elemental Ti–Al powder blends were mechanically alloyed in order to study phase formation during the alloying process. In addition, the stability of intermetallic phases upon milling was investigated separately in order to determine the origins of phase selection during the milling process. It was found that by mechanical alloying of powder blends, as well as by ball milling of Ti-aluminides for long milling times, the same metastable phases were formed for corresponding compositions, i.e., the hep solid solution for Al concentrations up to 60 at. % and the fcc solid solution for 75 at. % Al. X-ray diffraction (XRD) analyses indicated that the process of mechanical alloying occurred via the diffusion of Al into Ti. By lowering the milling intensity, a two-phase mixture of the hcp solid solution and the amorphous phase was observed for Ti50Al50 and confirmed by transmission electron microscopy (TEM). The results show that phase selection in the final state during mechanical alloying of Ti–Al powder blends and milling of intermetallic compounds is mainly determined by the energetic destabilization of the competing phases caused by the milling process. The destabilization is most pronounced in the case of intermetallic compounds due to the decrease in long-range order upon milling. For the final milling stage, phase formation can be predicted by considering the relative stabilities of the respective phases calculated by the CALPHAD method using the available thermodynamic data for the Ti–Al system.


2007 ◽  
Vol 22 (6) ◽  
pp. 1502-1511 ◽  
Author(s):  
Huashan Liu ◽  
Hang Wang ◽  
Wenjun Zhu ◽  
Xiaoma Tao ◽  
Zhanpeng Jin

Formation of intermetallic compounds (IMCs) at the interface between two metals during soldering processing exerts much influence on the electrical and mechanical performance of integrate circuits (ICs). Considering both of the thermodynamic and kinetic factors (including nucleation and growth) on phase formation, a new model capable of predicting phase formation sequence at the interface between two metals with different structures has been proposed in this work. Application of this new model on the interfacial reactions between pure elemental pairs of metals such as Ni/Sn, Cu/In, Cu/Sn, and Co/Sn at different temperatures shows good agreement between predictions by this model and experimental observations.


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