Optical Waveform Probing – Strategies for Non-Fllpchlp Devices and Other Applications
Abstract Optical waveform probing is a critical component in flipchip diagnostics. There is a dramatic increase in the need for backside silicon probing of non-flipchip packaged devices. The effective way to implement this strategy is to package the die in a BGA carrier that allows backside analysis. Optical waveform probing has been used primarily as a digital waveform timing analysis tool. The capability of optical waveform probers can be extended to failsite isolation and qualitative analog signal analysis.
2008 ◽
Vol 385-387
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pp. 601-604
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2020 ◽
Vol 30
(5)
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pp. 1-9
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2018 ◽
Vol 28
(5)
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pp. 1-5
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2014 ◽
Vol 2014
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pp. 1-10
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