New Developments in High-Resolution X-ray Computed Tomography for Non-Destructive Defect Detection in Next Generation Package Technologies
Abstract The development of a next generation high-resolution x-ray Computed Tomography (CT) tool and its applications are reported in this paper. Some of the key features are region of interest capability, improved time-to-data, improved usability, and data collection automation capability. We also discuss the key technical challenges that are faced by x-ray CT technology. Critical cases that are hard or not possible to isolate by alternative methods are also discussed. Examples include Controlled Collapse Chip Connection (C4) bump cracking and “invisible” non-wetting analysis, ball grid array (BGA) solder joint cracking, and wirebond microcracking and wirebond shorting, as well as demonstration of progressive testing capability.
Non-destructive characterization of additively manufactured components with x-ray computed tomography for part qualification: A study with laboratory and synchrotron x-rays